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US 2026/0142355 A1Published application
Protection circuit module and battery pack
AssigneeSamsung SDI Co., Ltd.
InventorJoon Gu Yoon
Life of this patent
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Abstract
Embodiments of the present disclosure relates to a protection circuit module, and the technical problem to be solved is to provide a protection circuit module capable of dissipating heat. To this end, embodiments of the present disclosure provides a protection circuit module including a substrate, a circuit pattern disposed on the substrate, and an insulating layer provided on the substrate while covering the circuit pattern, wherein the insulating layer includes an opening formed on a side of at least a portion of the circuit pattern.
Claims20
A protection circuit module comprising:
- a substrate;
- a circuit pattern disposed on the substrate;
- and
- an insulating layer provided on the substrate while covering the circuit pattern,
- wherein the insulating layer includes an opening formed on a side of at least a portion of the circuit pattern.
2 more elements
A battery pack comprising:
- a plurality of secondary batteries;
- and
- a protection circuit module disposed on one side of the plurality of secondary batteries and electrically connected to the plurality of secondary batteries,
- wherein the protection circuit module includes:
- a substrate;
- a circuit pattern disposed on the substrate;
- and
- an insulating layer provided on the substrate while covering the circuit pattern, and
- wherein the insulating layer includes an opening formed on a side of at least a portion of the circuit pattern.
6 more elements
Dependencies are inferred from the claim text.