Ceramic/organic multilayer interconnection board
AssigneeRockwell International Corporation
InventorJoseph M. Shaheen
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Abstract
A multilayer board comprising a novel construction of ceramic and organic layers to reduce difficulties commonly encountered by board materials and components attached thereto having differing thermal coefficients of expansion. The multilayer board comprises an inorganic ceramic surface which is affixedly attached via a compliant adhesive to a conventional plated up post or plated thru hole organic multilayer board.
Claims14
A ceramic/organic multilayer board functioning to reduce the thermal coefficient of expansion mismatches between component carriers mounted on said multilayer board comprising in combination:
- an organic inner layer having a top and bottom surface;
- a duality of compliant adhesive layers each respectively positioned on said top and said bottom surface;
- and
- a duality of inorganic ceramic layers each respectively affixed to said compliant adhesive layers.
A ceramic/organic multilayer composite structure comprising in combination:
- a conventional organic multilayer board having a top side and a bottom side;
- an adhesive applied to said top and to said bottom side;
- and
- an inorganic ceramic layer affixed to said top and to said bottom side via said adhesive, said adhesive being disposed between said conventional multilayer board's top and bottom sides and between said inorganic ceramic layers.
A multilayer board comprising in combination:
- an organic layer forming a printed circuit board;
- a compliant adhesive layer positioned on said organic layer;
- and
- an inorganic ceramic layer positioned atop said compliant adhesive layer.
Dependencies are inferred from the claim text.