US 12,690,172 B2 · Data throughput using a metal bracket

Abstract

Aspects of the present disclosure configure a memory sub-system processor to use a triangular shaped metal bracket to improve heat dissipation to improve a data transfer rate. The triangular shaped metal bracket being physically attached to an edge of the PCB at a base portion of the triangular shaped metal bracket. The triangular shaped metal bracket is thermally coupled to the set of memory components and the processing device of the PCB via the base portion along with a heat spreader on a primary and secondary side of the bracket. The triangular shaped metal bracket being configured to dissipate heat from the processing device and the set of memory components to at least a host device through a vertex portion of the triangular shaped metal bracket.

Claims20

Dependent claims

A system comprising:

a printed circuit board (PCB) comprising:
a set of memory components of a memory sub-system;
and
a processing device operatively coupled to the set of memory components;
and
a metal bracket comprising a base portion and a vertex portion, the metal bracket being physically attached to an edge of the PCB at the base portion, the metal bracket being thermally coupled to the set of memory components and the processing device of the PCB via the base portion, and the metal bracket being configured to dissipate heat from the processing device and the set of memory components through the vertex portion,
wherein the processing device is configured to perform operations comprising:
measuring temperature of at least one of the processing device or the set of memory components;
and
adjusting a data transfer rate based on the measured temperature of the at least one of the processing device or the set of memory components.

7 more elements

Dependencies are inferred from the claim text.

Data throughput using a metal bracket

Life of this patent

Data throughput using a metal bracket

Life of this patent

Abstract

Claims20