H05K 2201/09181
Notches in edge pads
H05K2201/09181 (Notches in edge pads) appears on 430 US grants and 353 published applications in this corpus.
Search patents in H05K- Granted patents
- 430
- Published applications
- 353
- Assignees
- 264
- Inventors
- 928
- Latest grant
- 30 Jun 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 1 | 0 |
| 1981 | 3 | 0 |
| 1982 | 2 | 0 |
| 1983 | 3 | 0 |
| 1984 | 2 | 0 |
| 1985 | 7 | 0 |
| 1986 | 5 | 0 |
| 1987 | 5 | 0 |
| 1988 | 2 | 0 |
| 1989 | 3 | 0 |
| 1990 | 11 | 0 |
| 1991 | 4 | 0 |
| 1992 | 3 | 0 |
| 1993 | 0 | 0 |
| 1994 | 2 | 0 |
| 1995 | 3 | 0 |
| 1996 | 9 | 0 |
| 1997 | 14 | 0 |
| 1998 | 8 | 0 |
| 1999 | 7 | 0 |
| 2000 | 15 | 0 |
| 2001 | 8 | 6 |
| 2002 | 22 | 14 |
| 2003 | 20 | 23 |
| 2004 | 17 | 18 |
| 2005 | 8 | 18 |
| 2006 | 15 | 24 |
| 2007 | 14 | 14 |
| 2008 | 10 | 25 |
| 2009 | 15 | 22 |
| 2010 | 19 | 19 |
| 2011 | 10 | 19 |
| 2012 | 20 | 8 |
| 2013 | 9 | 13 |
| 2014 | 9 | 19 |
| 2015 | 18 | 18 |
| 2016 | 9 | 12 |
| 2017 | 20 | 10 |
| 2018 | 14 | 11 |
| 2019 | 8 | 12 |
| 2020 | 11 | 8 |
| 2021 | 10 | 5 |
| 2022 | 11 | 7 |
| 2023 | 3 | 6 |
| 2024 | 9 | 16 |
| 2025 | 9 | 3 |
| 2026 | 2 | 3 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Sensor interposer employing castellated through-vias30 Jun 2026US 12,672,235 B2DexCom, Inc.
- Circuit board assembly and electronic device27 Jan 2026US 12,538,426 B2Honor Device Co., Ltd.
- Board-to-board connection structure for PCB23 Sep 2025US 12,424,773 B2Guangzhou Kanglong Electronics Co., Ltd.
- Circuit board and method for manufacturing same, and electronic device comprising same circuit board29 Jul 2025US 12,376,238 B2Stemco Co., Ltd.
- Circuit and connector element alignment, circuit board assemblies22 Jul 2025US 12,369,253 B2Infineon Technologies Austria AG
- Sensor interposer employing castellated through-vias17 Sep 2026US 2026/0282225 A1DexCom, Inc.
- Laminated substrate and method for manufacturing the same28 May 2026US 2026/0150196 A1Monolithic Power Systems, Inc.
- Localized Soldering U&C Shape with Metal Pin Design19 Feb 2026US 2026/0052633 A1Apple Inc.
- Electrically Conducting Structure for Flexible Circuit Board28 Aug 2025US 2025/0275059 A1Dongguan Kangxiang Electronic Co., Ltd
- Circuit board assembly and terminal device3 Jul 2025US 2025/0220816 A1Triple Win Technology(Shenzhen) Co. Ltd.
Most cited
By later US patents
- Ceramic emitter substrate831US 8,355,766 B2Masimo Corporation · 2013
- Plated plastic castellated interconnect for electrical components301US 5,069,626 AWestern Digital Corporation · 1991
- Methods for assembling multiple semiconductor devices202US 7,198,980 B2Micron Technology, Inc. · 2007
- Strip line circuit component and method of manufacture170US 4,821,007 ATektronix, Inc. · 1989
- Semiconductor device assemblies and packages including multiple semiconductor devices and methods145US 6,906,415 B2Micron Technology, Inc. · 2005