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US 2026/0052633 A1Published application
Localized Soldering U&C Shape with Metal Pin Design
AssigneeApple Inc.
InventorsTiexuan Wang, Minh C. Dang, Yajun Lu, Wei Wu, Yong Gang Li
Life of this patent
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Abstract
Electronic assemblies and methods of joining components are described. The electronic assemblies may include a bottom component with one or more pins mounted over a top component with one or more recesses, where the pins of the bottom component align with the recesses of the top component. Further, the recesses and pins may be structured so that the shape of the pins matches the shape of the recesses, and that the recesses at least partially surround the pins.
Claims20
An electronic assembly comprising:
- a bottom component, wherein the bottom component includes one or more pins;
- a top component mounted over the bottom component, the top component including one or more recesses located within outer perimeter lateral edges of the top component that at least partially surround the one or more pins, wherein a recess contour of the one or more recesses is structured to receive a pin contour of the one or more pins;
- and
- one or more solder joints that connect the one or more pins to the one or more recesses.
1 more element
A method for joining components comprising:
- mounting a top component over a bottom component, the bottom component including one or more pins, and the top component including one or more recesses located within outer perimeter lateral edges of the top component that at least partially surround the one or more pins, wherein a recess contour of the one or more recesses is structured to receive a pin contour of the one or more pins;
- and
- soldering the one or more pins to the one or more recesses.
Dependencies are inferred from the claim text.