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US 12,376,238 B2Granted
Circuit board and method for manufacturing same, and electronic device comprising same circuit board
AssigneeStemco Co., Ltd.
InventorsSung Jin Lee, Kang Dong Kim, Chang Hoon Han, Chul Ho Yoon, Ho Byung Kim, Hyun Woo Kim, Gun Woo Shin
Life of this patent
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Abstract
A circuit board including a contact terminal on a side thereof, a method of fabricating the circuit board, and an electronic device including the circuit board are provided. The circuit board includes: a base layer; a wiring layer formed on the base layer; and a terminal section formed at a level corresponding to the wiring layer, on a first surface and a side surface of one end portion of the base layer.
Claims13
A circuit board comprising:
- a base layer;
- a wiring layer formed on the base layer;
- and a terminal section formed at a level corresponding to the wiring layer, on a first surface and a side surface of one end portion of the base layer, wherein a terminal formed on a side surface of the circuit board has a height that is less than one end of a substrate in a lateral thickness direction.
An electronic device comprising:
- a circuit board;
- a connecting conductor bonded to the circuit board using a conductive bonding material;
- and a device installed apart from the circuit board, wherein the circuit board includes a base layer, a wiring layer formed on the base layer, and a terminal section formed at a level corresponding to the wiring layer, on a first surface and a side surface of one end portion of the base layer, wherein a terminal formed on a side surface of the circuit board has a height that is less than one end of a substrate in a lateral thickness direction.
A method of fabricating a circuit board, comprising:
- once a circuit board, including a base layer, a first wiring layer, and an insulating layer, is prepared, forming a through hole in an outer region of the insulating layer;
- forming a metal film and plating resist on both surfaces of the circuit board;
- performing exposure and development on the circuit board;
- and forming a second wiring layer and a terminal section on a top surface and a side surface of the insulating layer, wherein a terminal formed on a side surface of the circuit board has a height that is less than one end of a substrate in a lateral thickness direction.
1 more element
Dependencies are inferred from the claim text.