H05K 2201/09172
Notches between edge pads
H05K2201/09172 (Notches between edge pads) appears on 168 US grants and 146 published applications in this corpus.
Search patents in H05K- Granted patents
- 168
- Published applications
- 146
- Assignees
- 145
- Inventors
- 418
- Latest grant
- 17 Feb 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 2 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 2 | 0 |
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 5 | 0 |
| 1986 | 1 | 0 |
| 1987 | 2 | 0 |
| 1988 | 0 | 0 |
| 1989 | 2 | 0 |
| 1990 | 3 | 0 |
| 1991 | 7 | 0 |
| 1992 | 4 | 0 |
| 1993 | 1 | 0 |
| 1994 | 2 | 0 |
| 1995 | 1 | 0 |
| 1996 | 3 | 0 |
| 1997 | 4 | 0 |
| 1998 | 1 | 0 |
| 1999 | 2 | 0 |
| 2000 | 3 | 0 |
| 2001 | 4 | 1 |
| 2002 | 4 | 2 |
| 2003 | 2 | 1 |
| 2004 | 0 | 5 |
| 2005 | 0 | 9 |
| 2006 | 3 | 6 |
| 2007 | 4 | 7 |
| 2008 | 8 | 9 |
| 2009 | 3 | 5 |
| 2010 | 9 | 8 |
| 2011 | 7 | 8 |
| 2012 | 6 | 6 |
| 2013 | 3 | 7 |
| 2014 | 5 | 4 |
| 2015 | 8 | 7 |
| 2016 | 6 | 9 |
| 2017 | 3 | 4 |
| 2018 | 5 | 3 |
| 2019 | 7 | 10 |
| 2020 | 6 | 9 |
| 2021 | 7 | 9 |
| 2022 | 9 | 7 |
| 2023 | 3 | 2 |
| 2024 | 6 | 5 |
| 2025 | 1 | 1 |
| 2026 | 2 | 2 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Three-dimensional wired circuit board structure17 Feb 2026US 12,557,218 B2Guangzhou Kanglong Electronics Co., Ltd.
- Printed circuit board for use with an exterior lighting device of a motor vehicle, and motor vehicle13 Jan 2026US 12,526,916 B2Hella GmbH & Co. KGaA
- Apparatuses including one or more semiconductor devices and related systems17 Jun 2025US 12,336,134 B2Micron Technology, Inc.
- Substrate and memory system22 Oct 2024US 12,127,346 B2Kioxia Corporation
- Wiring board, electronic component package, and electronic apparatus20 Aug 2024US 12,068,420 B2KYOCERA Corporation
- Notch Design and Rocking Fixture for Board Stacking13 Aug 2026US 2026/0239537 A1Apple Inc.
- Voltage converter and method for producing a voltage converter5 Mar 2026US 2026/0066784 A1
- Electronic connectors for use on board a spacecraft19 Jun 2025US 2025/0202144 A1Airbus Defence and Space GmbH
- Wiring board, electronic component package, and electronic apparatus5 Dec 2024US 2024/0405130 A1KYOCERA Corporation
- Conductive memory module notch and connector-to-motherboard pins for power or ground28 Nov 2024US 2024/0397628 A1Intel Corporation
Most cited
By later US patents
- Packages for stacked integrated circuit chip cubes112US 5,343,366 AInternational Business Machines Corporation · 1994
- Modular interconnecting electronic circuit blocks84US 4,969,827 AMotorola, Inc. · 1990
- Electrical interconnect for a head/arm assembly of computer disk drives73US 5,422,764 AHewlett-Packard Company · 1995
- Magnetic component assembly63US 6,124,778 ASun Microsystems, Inc. · 2000
- Communication connector with improved crosstalk compensation53US 7,850,492 B1Panduit Corp. · 2010