Wiring board, electronic component package, and electronic apparatus
AssigneeKYOCERA Corporation
InventorToshihiko Kitamura
Life of this patent
Estimating the term…
Abstract
A dielectric substrate has a first surface including a first terminal connector and a second terminal connector located along a first side surface. A recess is between the first terminal connector and the second terminal connector. The recess has a first inner surface continuous with the first terminal connector, a second inner surface continuous with the second terminal connector, and a bottom surface between the first inner surface and the second inner surface. The first terminal connector has first wettability with a bond on its surface, and a first region has second wettability with the bond on its surface lower than the first wettability.
Claims13
A wiring board, comprising:
- a dielectric substrate having
- a first surface,
- a second surface opposite to the first surface,
- a first side surface continuous with the first surface and the second surface, and
- a recess being open in the first surface and the first side surface,
- wherein the first surface includes a first connector and a second connector located along the first side surface,
- the recess is between the first connector and the second connector, and has a first inner surface continuous with the first connector, a second inner surface continuous with the second connector, and a bottom surface between the first inner surface and the second inner surface,
- the first inner surface includes a first region and a second region closer to the bottom surface than the first region, and
- the first connector has first wettability, and the first region has second wettability lower than the first wettability.
A wiring board, comprising:
- a dielectric substrate having
- a first surface,
- a second surface opposite to the first surface,
- a first side surface continuous with the first surface and the second surface, and
- a recess being open in the first surface and the first side surface,
- wherein the first surface includes a first connector and a second connector located along the first side surface,
- the recess is between the first connector and the second connector, and has a first inner surface continuous with the first connector, a second inner surface continuous with the second connector, and a bottom surface between the first inner surface and the second inner surface,
- the first inner surface includes a first region and a second region closer to the bottom surface than the first region,
- the first connector includes a metal layer, and the first connector has a surface being a surface of the metal layer, and
- the first region includes a dielectric material included in the dielectric substrate.
Dependencies are inferred from the claim text.