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US 2026/0313791 A1Published application
Circuit board and semiconductor package comprising same
AssigneeLG Innotek Co., Ltd.
InventorsTae Hyun KIM, Byung Kwan JUNG, Il Sik NAM
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Abstract
A circuit board according to an embodiment includes an insulating layer; and a lower pad part disposed on a lower surface of the insulating layer, wherein the lower pad part includes a plurality of second lower pads disposed along an edge of the lower surface of the insulating layer, a plurality of first lower pads disposed inside the plurality of second lower pads, and a plurality of bump parts disposed on lower surfaces of the plurality of second lower pads.
Claims20
A circuit board comprising:
- an insulating layer;
- a lower pad part disposed under a lower surface of the insulating layer;
- and
- a lower protective layer under the lower surface of the insulating layer,
- wherein the lower pad part includes:
- a plurality of second lower pads disposed along an edge of the lower surface of the insulating layer,
- a plurality of first lower pads disposed inside the plurality of second lower pads, and
- a plurality of bump parts disposed on lower surfaces of the plurality of second lower pads, and
- wherein the lower protective layer includes a through hole overlapping the plurality of first lower pads in a vertical direction as a whole.
6 more elements
A semiconductor package comprising:
- a circuit board;
- a first semiconductor device disposed under the circuit board;
- a second semiconductor device disposed on the circuit board;
- and
- a main board disposed under the first semiconductor device,
- wherein the circuit board comprises:
- an insulating layer;
- a lower pad part including a plurality of first lower pads disposed on a lower surface of the insulating layer and overlapping the first semiconductor device in a vertical direction, and a plurality of second lower pads disposed in an outer edge region of the lower surface of the insulating layer and surrounding the plurality of first lower pads;
- and
- a bump part disposed under the plurality of second lower pads of the lower pad part and overlapping the first semiconductor device in a horizontal direction, and
- wherein the bump part is provided with a certain thickness under the circuit board and surrounding an outer surface of the first semiconductor device.
8 more elements
Dependencies are inferred from the claim text.