Circuit board and electronic device
AssigneeShenzhen Jufei Optoelectronics Co., Ltd.
InventorsMingquan Li, Wenqin Xu, Pingru Sun
Life of this patent
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Abstract
The present application relates to a circuit board and an electronic device. The first slit is used to divide the metal layer on the substrate into at least two first regions and second regions that are alternately distributed and mutually insulated in a row direction and a column direction; the second slit in each row direction of the first regions is interrupted by the first extension portion of at least a portion of the metal sheets within the first regions along the column direction; the second slit in each column direction of the second regions is interrupted by the second extension portion of at least a portion of the metal sheets within the second regions along the row direction.
Claims15
A circuit board, comprising at least one substrate, and a metal layer provided on a front surface and/or a back surface of the substrate, wherein the metal layer is provided with a region array, the region array comprises at least two first regions and at least two second regions formed by division through a first slit, and the first regions and the second regions are alternately distributed and mutually insulated in both a row direction and a column direction of the region array;
- each of the first regions and the second regions is provided with at least two mutually insulated metal sheets formed by division through a second slit, and the two adjacent metal sheets within each of the first regions and the second regions are correspondingly provided with solder pads for connecting with an electronic component;
- the solder pads within each of the first regions and the second regions are arranged in a multi-row and multi-column array on the substrate to form a solder pad array;
- at least a portion of the metal sheets within each of the first regions are provided with a first extension portion that extends along a column direction of the solder pad array, and in each row direction of the solder pad array within each of the first regions, the second slit is interrupted by the first extension portion;
- at least a portion of the metal sheets within each of the second regions are provided with a second extension portion that extends along a row direction of the solder pad array, and in each column direction of the solder pad array within each of the second regions, the second slit is interrupted by the second extension portion;
- wherein a width of the first slit is less than a width of the second slit.
An electronic device, comprising electronic components and a circuit board, the circuit board comprising at least one substrate, and a metal layer provided on a front surface and/or a back surface of the substrate, wherein the metal layer is provided with a region array, the region array comprises at least two first regions and at least two second regions formed by division through a first slit, and the first regions and the second regions are alternately distributed and mutually insulated in both a row direction and a column direction of the region array;
- each of the first regions and the second regions is provided with at least two mutually insulated metal sheets formed by division through a second slit, and the two adjacent metal sheets within each of the first regions and the second regions are correspondingly provided with solder pads for connecting with an electronic component;
- the solder pads within each of the first regions and the second regions are arranged in a multi-row and multi-column array on the substrate to form a solder pad array;
- at least a portion of the metal sheets within each of the first regions are provided with a first extension portion that extends along a column direction of the solder pad array, and in each row direction of the solder pad array within each of the first regions, the second slit is interrupted by the first extension portion;
- at least a portion of the metal sheets within each of the second regions are provided with a second extension portion that extends along a row direction of the solder pad array, and in each column direction of the solder pad array within each of the second regions, the second slit is interrupted by the second extension portion;
- wherein the electronic components are provided on the circuit board and soldered to the corresponding solder pads.
A circuit board, comprising at least one substrate, and a metal layer provided on a front surface and/or a back surface of the substrate, wherein the metal layer is provided with a region array, the region array comprises at least two first regions and at least two second regions formed by division through a first slit, and the first regions and the second regions are alternately distributed and mutually insulated in both a row direction and a column direction of the region array;
- each of the first regions and the second regions is provided with at least two mutually insulated metal sheets formed by division through a second slit, and the two adjacent metal sheets within each of the first regions and the second regions are correspondingly provided with solder pads for connecting with an electronic component;
- the solder pads within each of the first regions and the second regions are arranged in a multi-row and multi-column array on the substrate to form a solder pad array;
- at least a portion of the metal sheets within each of the first regions are provided with a first extension portion that extends along a column direction of the solder pad array, and in each row direction of the solder pad array within each of the first regions, the second slit is interrupted by the first extension portion;
- at least a portion of the metal sheets within each of the second regions are provided with a second extension portion that extends along a row direction of the solder pad array, and in each column direction of the solder pad array within each of the second regions, the second slit is interrupted by the second extension portion;
- wherein the second slits within the first regions and the second regions comprise main slits and branch slits, wherein the main slits extend along the row direction or the column direction of the solder pad array, and the branch slits separate the solder pads between the adjacent metal sheets and are connected to the main slits, with one main slit connected to a plurality of the branch slits;
- extension directions of the main slits within the first regions are perpendicular to extension directions of the main slits within the second regions.
Dependencies are inferred from the claim text.