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US 12,757,330 B2Granted
Lens module with multi-layer bent circuit board and electronic device having the same
AssigneeTriple Win Technology(Shenzhen) Co. Ltd.
InventorsZheng-Zhi Lun, Zhi-Hao Si, Hui-Hui Shang Guan, Hu Zhu, Xiao-Fei Wang
Life of this patent
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Abstract
A lens module includes a lens assembly, a sensing assembly with a supporting member and a sensor, a first circuit board, and a second circuit board. The supporting member is on one side of the lens assembly. The sensor is between them. The first circuit board is adjacent in another direction. The second circuit board connects the sensor and the first circuit board.
Claims18
A lens module comprising:
- a lens assembly;
- a sensing assembly;
- a first circuit board, and a second circuit board;
- wherein the sensing assembly comprises a supporting member and a sensor, the lens assembly and the sensor are disposed on one surface of the supporting member in a first direction, the sensor is disposed between the supporting member and the lens assembly and faces the lens assembly along the first direction;
- the first circuit board is disposed adjacent to the supporting member in a second direction, the first direction intersects with the second direction;
- one portion of the second circuit board is bent to connect to the sensor and another portion of the second circuit board is bent to connect to the first circuit board;
- the second circuit board comprises a first structural layer, a second structural layer, a third structural layer, and a fourth structural layer sequentially stacked, wherein the first structural layer is configured to transmit power signals, the third structural layer is configured to transmit high-speed signals, and the second structural layer and the fourth structural layer are configured to connect to ground.
4 more elements
An electronic device comprising a lens module comprising:
- a lens assembly;
- a sensing assembly comprising a supporting member and a sensor;
- a first circuit board, and
- a second circuit board, wherein
- the supporting member is disposed on one side of the lens assembly in a first direction, the sensor is disposed between the supporting member and the lens assembly, the sensor is arranged opposite to the lens assembly along the first direction;
- the first circuit board is disposed adjacent to the supporting member in a second direction, the first direction intersects the second direction;
- one portion of the second circuit board is bent to connect to the sensor and another portion of the second circuit board is bent to connect to the first circuit board;
- the second circuit board comprises a first structural layer, a second structural layer, a third structural layer, and a fourth structural layer sequentially stacked, wherein the first structural layer is configured to transmit power signals, the third structural layer is configured to transmit high-speed signals, and the second structural layer and the fourth structural layer are configured to connect to ground signals.
5 more elements
Dependencies are inferred from the claim text.