H05K 2201/09209
Shape and layout details of conductors
H05K2201/09209 (Shape and layout details of conductors) appears on 15,205 US grants and 15,608 published applications in this corpus.
Search patents in H05K- Granted patents
- 15,205
- Published applications
- 15,608
- Assignees
- 3,195
- Inventors
- 25,635
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 21 | 0 |
| 1977 | 19 | 0 |
| 1978 | 17 | 0 |
| 1979 | 12 | 0 |
| 1980 | 14 | 0 |
| 1981 | 29 | 0 |
| 1982 | 29 | 0 |
| 1983 | 28 | 0 |
| 1984 | 37 | 0 |
| 1985 | 62 | 0 |
| 1986 | 53 | 0 |
| 1987 | 73 | 0 |
| 1988 | 65 | 0 |
| 1989 | 92 | 0 |
| 1990 | 89 | 0 |
| 1991 | 122 | 0 |
| 1992 | 114 | 0 |
| 1993 | 119 | 0 |
| 1994 | 138 | 0 |
| 1995 | 178 | 0 |
| 1996 | 165 | 0 |
| 1997 | 157 | 0 |
| 1998 | 230 | 0 |
| 1999 | 236 | 0 |
| 2000 | 285 | 0 |
| 2001 | 380 | 190 |
| 2002 | 445 | 449 |
| 2003 | 434 | 530 |
| 2004 | 491 | 626 |
| 2005 | 391 | 676 |
| 2006 | 502 | 803 |
| 2007 | 492 | 849 |
| 2008 | 523 | 938 |
| 2009 | 467 | 941 |
| 2010 | 612 | 743 |
| 2011 | 627 | 598 |
| 2012 | 673 | 535 |
| 2013 | 521 | 500 |
| 2014 | 433 | 623 |
| 2015 | 492 | 626 |
| 2016 | 512 | 543 |
| 2017 | 597 | 493 |
| 2018 | 492 | 516 |
| 2019 | 554 | 537 |
| 2020 | 541 | 631 |
| 2021 | 468 | 607 |
| 2022 | 528 | 592 |
| 2023 | 445 | 616 |
| 2024 | 463 | 518 |
| 2025 | 453 | 455 |
| 2026 | 285 | 473 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
- H05K 2201/09654Covering at least two types of conductors provided for in h05k2201/09218 -Indexing code6,830
- H05K 2201/095Conductive through-holes or viasIndexing code5,315
- H05K 2201/09372Pads and landsIndexing code3,429
- H05K 2201/09218Conductive tracesIndexing code2,850
- H05K 2201/0929Conductive planesIndexing code1,872
Recent patents
- Circuit board and electronic device6 Oct 2026US 12,757,322 B2Shenzhen Jufei Optoelectronics Co., Ltd.
- Wiring board, electronic component storage package, and electronic device6 Oct 2026US 12,757,324 B2KYOCERA Corporation
- Buried skip vias for improved signal and power integrity6 Oct 2026US 12,757,327 B2NVIDIA Corporation
- Flexible printed circuit to suspension soldering improvement6 Oct 2026US 12,757,332 B2Western Digital Technologies, Inc.
- Circuit board and manufacturing method thereof29 Sep 2026US 12,750,953 B2Samsung Electro-Mechanics Co., Ltd.
- Signal transmission structure for signal transmission in multi-layer circuit board and electronic device including the same8 Oct 2026US 2026/0312270 A1Samsung Electronics Co., Ltd.
- Stepped trace design for impedance compensation of high-speed differential pair channels8 Oct 2026US 2026/0313784 A1Advanced Micro Devices, Inc.
- Printed circuit board8 Oct 2026US 2026/0313787 A1Samsung Electro-Mechanics Co., Ltd.
- Circuit board and semiconductor package comprising same8 Oct 2026US 2026/0313791 A1LG Innotek Co., Ltd.
- Printed circuit board8 Oct 2026US 2026/0313794 A1Samsung Electro-Mechanics Co., Ltd.
Most cited
By later US patents
- Method and apparatus for 3D interconnect542US 8,076,237 B2ASM America, Inc. · 2011
- LED lamp assembly with means to conduct heat away from the LEDS470US 6,045,240 ARelume Corporation · 2000
- Electroless CU deposition on a barrier layer by CU contact displacement for ULSI applications448US 5,891,513 ACornell Research Foundation, Inc. · 1999
- Encapsulated semiconductor device package having holes for electrically conductive material423US 5,608,265 AHitachi, Ltd. · 1997
- Integrated structures and fabrication methods thereof implementing a cell phone or other electronic system387US 7,619,901 B2EPIC Technologies, Inc. · 2009