H05K 2201/0929
Conductive planes
H05K2201/0929 (Conductive planes) appears on 1,872 US grants and 1,838 published applications in this corpus.
Search patents in H05K- Granted patents
- 1,872
- Published applications
- 1,838
- Assignees
- 708
- Inventors
- 3,688
- Latest grant
- 22 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 4 | 0 |
| 1977 | 1 | 0 |
| 1978 | 0 | 0 |
| 1979 | 1 | 0 |
| 1980 | 3 | 0 |
| 1981 | 5 | 0 |
| 1982 | 2 | 0 |
| 1983 | 2 | 0 |
| 1984 | 7 | 0 |
| 1985 | 9 | 0 |
| 1986 | 4 | 0 |
| 1987 | 10 | 0 |
| 1988 | 7 | 0 |
| 1989 | 6 | 0 |
| 1990 | 12 | 0 |
| 1991 | 16 | 0 |
| 1992 | 17 | 0 |
| 1993 | 9 | 0 |
| 1994 | 16 | 0 |
| 1995 | 18 | 0 |
| 1996 | 26 | 0 |
| 1997 | 12 | 0 |
| 1998 | 28 | 0 |
| 1999 | 25 | 0 |
| 2000 | 34 | 0 |
| 2001 | 45 | 25 |
| 2002 | 56 | 59 |
| 2003 | 54 | 82 |
| 2004 | 74 | 85 |
| 2005 | 59 | 91 |
| 2006 | 82 | 116 |
| 2007 | 75 | 134 |
| 2008 | 76 | 124 |
| 2009 | 74 | 148 |
| 2010 | 88 | 119 |
| 2011 | 82 | 73 |
| 2012 | 116 | 60 |
| 2013 | 66 | 41 |
| 2014 | 47 | 49 |
| 2015 | 41 | 67 |
| 2016 | 57 | 47 |
| 2017 | 57 | 39 |
| 2018 | 42 | 56 |
| 2019 | 49 | 52 |
| 2020 | 65 | 77 |
| 2021 | 64 | 75 |
| 2022 | 63 | 55 |
| 2023 | 47 | 56 |
| 2024 | 52 | 42 |
| 2025 | 50 | 37 |
| 2026 | 17 | 29 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
- H05K 2201/09309Core having two or more power planesIndexing code748
- H05K 2201/093Layout of power planes, ground planes or power supply conductorsIndexing code617
- H05K 2201/09336Signal conductors in same plane as power planeIndexing code229
- H05K 2201/09327Special sequence of power, ground and signal layers in multilayer pcbIndexing code146
- H05K 2201/09354Ground conductor along edge of main surfaceIndexing code146
- H05K 2201/09318Core having one signal plane and one power planeIndexing code122
- H05K 2201/09345Power and ground in the same planeIndexing code81
- H05K 2201/09363Wherein only contours around conductors are removed for insulationIndexing code69
Recent patents
- PCB, PCB mounting box, case assembly, and case22 Sep 2026US 12,745,344 B2Zte Corporation
- Core resonance suppression in signal integrity optimized package15 Sep 2026US 12,739,967 B2Avago Technologies International Sales Pte. Limited
- Structurally enhanced filtering of circuit board planes18 Aug 2026US 12,713,518 B2Microsoft Technology Licensing, LLC
- Circuit board manufacturing method18 Aug 2026US 12,713,537 B2Ufab Corporation
- Thermal transfer, management and integrated control structure21 Jul 2026US 12,690,457 B23D Glass Solutions, Inc.
- Integrated circuit packages having ground paired partial pad vertical interconnect access24 Sep 2026US 2026/0293720 A1Intel Corporation
- Printed wiring board10 Sep 2026US 2026/0271184 A1KYOCERA Corporation
- Devices including capacitor coupling power path to ground path and associated components and systems20 Aug 2026US 2026/0247959 A1Microchip Technology Incorporated
- Printed circuit board (pcb) miniaturization by an embedded via-in-via design30 Jul 2026US 2026/0223279 A1Google Inc.
- Power semiconductor module23 Jul 2026US 2026/0215273 A1Dynex Semiconductor Limited
Most cited
By later US patents
- Memory system having synchronous-link DRAM (SLDRAM) devices and controller383US 6,442,644 B1Advanced Memory International, Inc. · 2002
- Memory card having static electricity protection250US 4,532,419 ASony Corporation · 1985
- Passive interposer including at least one passive electronic component225US 5,530,288 AInternational Business Machines Corporation · 1996
- Capacitor laminate for use in capacitive printed circuit boards and methods of manufacture188US 5,079,069 AZycon Corporation · 1992
- Thick film multilayer substrate185US 4,328,531 AHitachi, Ltd. · 1982