Printed circuit board (pcb) miniaturization by an embedded via-in-via design

A method of manufacturing a multi-layer printed circuit board (PCB), the method comprising:

• forming a first stack of alternative layers including metal layers and dielectric layers that are stacked alternatively over a top surface of a core layer of the PCB;
• forming a second stack of alternative layers including metal layers and dielectric layers that are stacked alternatively over a bottom surface of the core layer;
• and
• forming an embedded via structure that is through the core layer and connects a first metal layer of the first stack of alternative layers to a second metal layer of the second stack of alternative layers, the embedded via structure including a first signal path layer that is through the core layer, a first ground layer that is through the core layer and encloses the first signal path layer, and a first dielectric layer that is through the core layer and between the first signal path layer and the first ground layer.

A non-transitory computer-readable storage medium including computer executable instructions, wherein the instructions, when executed by a computer, cause the computer to perform a method, the method comprising:

• forming a first stack of alternative layers including metal layers and dielectric layers that are stacked alternatively over a top surface of a core layer of a multi-layer printed circuit board (PCB),;
• forming a second stack of alternative layers including metal layers and dielectric layers that are stacked alternatively over a bottom surface of the core layer;
• and
• forming an embedded via structure that is through the core layer and connects a first metal layer of the first stack of alternative layers to a second metal layer of the second stack of alternative layers, the embedded via structure including a first signal path layer that is through the core layer, a first ground layer that is through the core layer and encloses the first signal path layer, and a first dielectric layer that is through the core layer and between the first signal path layer and the first ground layer.