H05K 2201/09345
Power and ground in the same plane
Official title: Power and ground in the same plane; Power planes for two voltages in one plane
H05K2201/09345 (Power and ground in the same plane) appears on 81 US grants and 83 published applications in this corpus.
Search patents in H05K- Granted patents
- 81
- Published applications
- 83
- Assignees
- 64
- Inventors
- 214
- Latest grant
- 14 Apr 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 1 | 0 |
| 1993 | 1 | 0 |
| 1994 | 1 | 0 |
| 1995 | 0 | 0 |
| 1996 | 1 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 1 | 0 |
| 2000 | 4 | 0 |
| 2001 | 6 | 0 |
| 2002 | 2 | 10 |
| 2003 | 3 | 3 |
| 2004 | 4 | 4 |
| 2005 | 4 | 3 |
| 2006 | 3 | 6 |
| 2007 | 6 | 3 |
| 2008 | 3 | 6 |
| 2009 | 3 | 1 |
| 2010 | 3 | 2 |
| 2011 | 1 | 4 |
| 2012 | 3 | 4 |
| 2013 | 1 | 3 |
| 2014 | 4 | 3 |
| 2015 | 0 | 1 |
| 2016 | 1 | 2 |
| 2017 | 3 | 3 |
| 2018 | 2 | 3 |
| 2019 | 4 | 1 |
| 2020 | 4 | 6 |
| 2021 | 1 | 1 |
| 2022 | 4 | 4 |
| 2023 | 1 | 1 |
| 2024 | 2 | 2 |
| 2025 | 1 | 1 |
| 2026 | 2 | 6 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Electronic control device and ground line routing method14 Apr 2026US 12,604,393 B2Hitachi Astemo, Ltd.
- Devices including capacitor coupling power path to ground path and associated components and systems14 Apr 2026US 12,604,729 B2Microchip Technology Incorporated
- Signal processing board and image forming apparatus6 May 2025US 12,295,093 B2KYOCERA Document Solutions Inc.
- Circuit board and display device including the same29 Oct 2024US 12,130,979 B2Samsung Display Co., Ltd.
- Monolithic Pstages and methods for voltage regulators7 May 2024US 11,979,978 B2Dell Products L. P.
- Devices including capacitor coupling power path to ground path and associated components and systems20 Aug 2026US 2026/0247959 A1Microchip Technology Incorporated
- Printed wiring board18 Jun 2026US 2026/0173264 A1Japan Aviation Electronics Industry, Limited
- Electronic chip packaging11 Jun 2026US 2026/0165178 A1STMicroelectronics International N. V.
- Semicondcutor device and semicondcutor module arrangement28 May 2026US 2026/0150697 A1Infineon Technologies AG
- Motor driving circuit substrate, motor, and pump device16 Apr 2026US 2026/0107378 A1Nidec Instruments Corporation
Most cited
By later US patents
- Printed circuit board with capacitors connected between ground layer and power layer patterns113US 6,198,362 B1NEC Corporation · 2001
- Electrical interconnect device with interwoven power and ground lines and capacitive vias78US 5,272,600 AMicroelectronics and Computer Technology Corporation · 1993
- Double-sided memory board70US 5,095,407 AHitachi, Ltd. · 1992
- Multilayer circuit board56US 6,172,305 B2KYOCERA Corporation · 2001
- Printed circuit board routing and power delivery for high frequency integrated circuits47US 6,900,992 B2Intel Corporation · 2005