Devices including capacitor coupling power path to ground path and associated components and systems

A device comprising:

• an electronic die;
• a ground path;
• a quiet power path coupled to the electronic die;
• a multiterminal capacitor coupled between the quiet power path and the ground path, the multiterminal capacitor comprising:
• a first power terminal laterally aligned with a first ground terminal;
• and
• a second power terminal laterally aligned with a second ground terminal, the second power terminal on an opposite lateral side of the multiterminal capacitor from the first power terminal.

A method of manufacturing a device comprising:

• forming a power path and a quiet power path on a first built-up layer;
• forming at least one ground path on a second built-up layer;
• coupling the quiet power path to the at least one ground path through a capacitor;
• and
• coupling the power path to the quiet power path with an inductor.