Printed circuit board with capacitors connected between ground layer and power layer patterns
AssigneeNEC Corporation
InventorsTakashi Harada, Hideki Sasaki
Life of this patent
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Abstract
A printed circuit board is disclosed. A top layer power supply pattern and a top layer ground pattern are formed. The top layer power supply pattern and the top layer ground pattern are connected to a power supply layer and a ground layer through a plurality of viaholes, respectively. A plurality of capacitors or a plurality of capacitor resistor series circuits are disposed at predetermined intervals between the top layer power supply pattern and the top layer ground pattern.
Claims19
A printed circuit board having at least one wiring layer, a dielectric layer, a ground layer, and a power supply layer, the at least one wiring layer and the dielectric layer being alternately laminated, the ground layer supplying a reference voltage, the power supply layer supplying a power supply voltage, the ground layer and the power supply layer being disposed as inner layers, comprising:
- at least two separate conductive loops disposed along a periphery of at least one of two surfaces of the layers of the printed circuit board;
- a plurality of vias connecting each of said conductive loops to one of the ground layer and the power supply layer;
- and
- a plurality of capacitors connected between said separate conductive loops.
A printed circuit board having at least one wiring layer, a dielectric layer, a ground layer, and a power supply layer, the at least one wiring layer and the dielectric layer being alternately laminated, the ground layer supplying a reference voltage, the a power supply layer supplying a power supply voltage, the ground layer and the power supply layer being disposed as inner layers, comprising:
- at least three adjacent conductor patterns formed in a line along at least one edge of at least one of the layers of the printed circuit board;
- and
- a plurality of vias connecting each of the conductor patterns to one of the ground layer and the power supply layer, each said line of conductor patterns being arranged so that the via connections alternate between the ground layer and the power supply layer in successive said conductor patterns;
- wherein each of the conductor patterns within each said line of conductor patterns is connected to each adjacent said conductor pattern by a capacitor.
A printed circuit board having at least one wiring layer, a dielectric layer, a ground layer, and a power supply layer, the at least one wiring layer and the dielectric layer being alternately laminated, the ground layer supplying a reference voltage, the power supply layer supplying a power supply voltage, the ground layer and the power supply layer being disposed as inner layers, comprising:
- at least two separate belt-shaped conductive patterns disposed along a periphery of at least one of two surfaces of the layers of the printed circuit board;
- a plurality of vias connecting each of said separate belt-shaped conductive patterns to one of the ground layer and the power supply layer;
- and
- a plurality of capacitors connected between said separate belt-shaped conductive patterns.
Dependencies are inferred from the claim text.