H05K 2201/09363
Wherein only contours around conductors are removed for insulation
Official title: wherein only contours around conductors are removed for insulation
H05K2201/09363 (Wherein only contours around conductors are removed for insulation) appears on 69 US grants and 76 published applications in this corpus.
Search patents in H05K- Granted patents
- 69
- Published applications
- 76
- Assignees
- 71
- Inventors
- 188
- Latest grant
- 18 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1979 | 1 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 2 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 1 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 1 | 0 |
| 1996 | 2 | 0 |
| 1997 | 0 | 0 |
| 1998 | 1 | 0 |
| 1999 | 0 | 0 |
| 2000 | 1 | 0 |
| 2001 | 0 | 0 |
| 2002 | 1 | 0 |
| 2003 | 0 | 0 |
| 2004 | 0 | 0 |
| 2005 | 2 | 1 |
| 2006 | 2 | 4 |
| 2007 | 3 | 6 |
| 2008 | 0 | 4 |
| 2009 | 2 | 8 |
| 2010 | 8 | 5 |
| 2011 | 2 | 3 |
| 2012 | 5 | 1 |
| 2013 | 0 | 2 |
| 2014 | 1 | 3 |
| 2015 | 3 | 2 |
| 2016 | 4 | 8 |
| 2017 | 4 | 5 |
| 2018 | 4 | 1 |
| 2019 | 2 | 1 |
| 2020 | 1 | 1 |
| 2021 | 2 | 4 |
| 2022 | 3 | 3 |
| 2023 | 1 | 9 |
| 2024 | 2 | 3 |
| 2025 | 6 | 1 |
| 2026 | 2 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Circuit board manufacturing method18 Aug 2026US 12,713,537 B2Ufab Corporation
- Semiconductor device with improved control circuit pattern placement27 Jan 2026US 12,538,822 B2Fuji Electric Co., Ltd.
- LED illumination profile system and connecting technique18 Nov 2025US 12,474,024 B2Stepan Engineering GmbH
- Sidewall plating of circuit boards for layer transition connections5 Aug 2025US 12,382,581 B2International Business Machines Corporation
- Printed circuit board and image display device including same8 Jul 2025US 12,356,540 B2LG Electronics Inc.
- Multi-layer circuit board for closely packed light-emitting diode (led) arrays and method of manufacture8 Jan 2026US 2026/0013041 A1Lumileds LLC
- Led illumination profile system and connecting technique6 Mar 2025US 2025/0075866 A1Stepan Engineering GmbH
- Printed circuit board and image display device including same7 Nov 2024US 2024/0373547 A1LG Electronics Inc.
- Connection connecting technique for an led profile system, and led profile system17 Oct 2024US 2024/0347991 A1Stepan Engineering GmbH
- Circuit board manufacturing system and method15 Feb 2024US 2024/0057260 A1Ufab Corporation
Most cited
By later US patents
- Method for manufacturing printed circuit boards96US 4,943,346 ASiemens Aktiengesellschaft · 1990
- Electrolytic method of depositing gold connectors on a printed circuit board63US 5,733,466 AInternational Business Machines Corporation · 1998
- Method for manufacturing printed circuit board49US 5,494,781 AMatsushita Electric Works, Ltd. · 1996
- Method for fabricating semiconductor components31US 6,107,119 AMicron Technology, Inc. · 2000
- Illumination assembly with enhanced thermal conductivity28US 7,710,045 B23M Innovative Properties Company · 2010