Method for fabricating semiconductor components
AssigneeMicron Technology, Inc.
InventorsWarren M. Farnworth, Alan G. Wood
Life of this patent
Estimating the term…
Abstract
A method for fabricating semiconductor components such as printed circuit boards, multi chip modules, chip scale packages, and test carriers is provided. The method includes providing a substrate having a blanket deposited conductive layer thereon. Using a laser machining process, grooves are formed in the conductive layer to define patterns of conductors on the substrate. The conductors can be formed with a desired size and spacing, and can include features such as bond pads, conductive vias, and external ball contacts. In addition, selected conductors can be configured as co-planar ground or voltage traces, for adjusting impedance values in other conductors configured as signal traces.
Claims24
A method for fabricating a semiconductor component comprising:
- providing a substrate comprising a surface and a conductive layer on the surface;
- laser machining a plurality of grooves through the conductive layer to the surface to define a plurality of conductors on the surface and a plurality of pads on the surface in electrical communication with the conductors, each conductor and each pad comprising a portion of the conductive layer with a groove on either side thereof;
- and
- mounting a semiconductor die to the substrate in electrical communication with the pads.
A method for fabricating a semiconductor component comprising:
- providing a substrate comprising a first surface, an opposing second surface, and a conductive layer on the first surface;
- laser machining a plurality of grooves through the conductive layer to the surface to define a plurality of conductors on the surface, each conductor comprising a portion of the conductive layer with a groove on either side thereof;
- laser machining a plurality of vias in the substrate in electrical communication with the conductors, each via extending from the first surface to the second surface;
- depositing a conductive material in the vias to form a plurality of conductive vias;
- and
- forming a plurality of contacts on the second surface in electrical communication with the conductive vias.
A method for fabricating a semiconductor component comprising:
- providing a substrate comprising a surface and a conductive layer on the surface;
- laser machining a plurality of grooves through the conductive layer to the surface to define a plurality of conductors on the surface, each conductor comprising a portion of the conductive layer with a groove on either side thereof;
- laser machining a plurality of pads on the surface in electrical communication with the conductors;
- and
- mounting a semiconductor die to the substrate in electrical communication with the pads.
A method for fabricating a semiconductor component comprising:
- providing a substrate comprising a surface and a conductive layer on the surface having a thickness;
- and
- laser machining a plurality of grooves through the conductive layer to the surface to define a first conductor and a second conductor on the surface, the first conductor comprising a signal path for the component, the second conductor in electrical communication with a ground path or a voltage path, with the thickness of the conductive layer and a width of the grooves selected to provide an impedance value for the first conductor.
A method for fabricating a semiconductor component comprising:
- providing a substrate comprising a surface and a conductive layer on the surface having a thickness;
- laser machining a plurality of conductors in the conductive layer, each conductor defined by a pair of grooves through the conductive layer, the conductors comprising a plurality of first pads;
- mounting a semiconductor die comprising a plurality second pads to the substrate by bonding the second pads to the first pads;
- and
- selecting the thickness of the conductive layer, and a width of the grooves, to provide an impedance for the conductors.
A method for fabricating a semiconductor component comprising:
- providing a substrate comprising a first surface, an opposing second surface, and a conductive layer on the first surface;
- laser machining a plurality of grooves through the conductive layer to the first surface to define a plurality of conductors on the first surface, each conductor comprising a portion of the conductive layer with a groove on either side thereof;
- forming a plurality of conductive vias in the substrate in electrical communication with the conductors, each conductive via extending from the first surface to the second surface;
- forming a plurality of contacts on the second surface in electrical communication with the conductive vias;
- and
- mounting a semiconductor die to the first surface in electrical communication with the conductors.
Dependencies are inferred from the claim text.