Method for manufacturing printed circuit board

A method for manufacturing a printed circuit board in which a pattern of electric circuits is formed with a conducting material on a surface of an insulating substrate, comprising the steps of:

• (a) providing a metal film of said conducting material on said surface of the insulating substrate, said metal film including a plurality of printed circuit forming parts for forming said pattern of electric circuits and a plurality of non-circuit parts for forming an insulating space between said printed circuit forming parts,
• (b) adhering a resist made removable upon irradiation of electromagnetic waves selected from the group consisting of coherent light, X-rays and ultraviolet rays onto the surface of said metal film, said resist being one selected from the group consisting of a first resist made soluble to a developer upon an exposure by means of said irradiation and a second resist evaporizable upon said irradiation,
• (c) irradiating the electromagnetic waves onto said resist on the metal film at a boundary edge zone of said non-circuit parts along said printed circuit forming parts on the insulating substrate to remove the resist at irradiated parts while allowing the resist to remain at said printed circuit forming parts which have not been irradiated, and
• (d) thereafter removing the metal film uncovered during said step c at said boundary edge zone of the non-circuit parts through a surface treatment with an etching solution.

A method for manufacturing a printed circuit board in which a pattern of electric circuits is formed with a conducting material on a surface of an insulating substrate, comprising the steps of:

• (a) providing a metal film on said surface of the insulating substrate, said metal film including a plurality of printed circuit forming parts for forming said pattern of electric circuits and a plurality of non-circuit parts for forming an insulating space between said printed circuit forming parts,
• (b) adhering a resist made insoluble to a developer upon an exposure by means of irradiation of electromagnetic waves selected from the group consisting of coherent light, X-rays and ultraviolet rays to a surface of said metal film,
• (c) irradiating the electromagnetic waves onto said resist at a boundary edge zone of said non-circuit parts along said printed circuit forming parts on the insulating substrate to remove the resist at the non-circuit parts which have not been irradiated while allowing the resist to remain at said boundary edge zone of the non-circuit parts irradiated,
• (d) thereafter plating said conducting material on said surface of the metal film uncovered with the resist removed at said printed circuit forming and non-circuit parts which have not been irradiated,
• (e) then peeling off the resist left at the boundary edge zone, and
• (f) removing the metal film uncovered at the parts where the resist has been peeled off of the boundary edge zone at said step (e) through a surface treatment with an etching solution.