Semiconductor device with improved control circuit pattern placement
AssigneeFuji Electric Co., Ltd.
InventorTomoya Hirata
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AssigneeFuji Electric Co., Ltd.
InventorTomoya Hirata
Estimating the term…
A semiconductor device includes a cooling base board and an insulated circuit substrate. On a front surface of an insulated board on the insulated circuit substrate, a high potential circuit pattern on which a semiconductor chip is mounted, an intermediate potential circuit pattern on which a semiconductor chip is mounted, a low potential circuit pattern, and a control circuit pattern are disposed so as to straddle a center line of the cooling base board. The intermediate potential circuit pattern includes a second chip mounting region, an output wiring connection region and an interconnect wiring region that form a U-shaped portion in which the high potential circuit pattern having a semiconductor chip thereon is disposed. The control circuit pattern is disposed so as to straddle the center line and faces the opening of the U-shaped portion.
A semiconductor device, comprising:
Dependencies are inferred from the claim text.