Circuit board manufacturing method
AssigneeUfab Corporation
InventorTyler Richards
Life of this patent
Estimating the term…
Abstract
A method of manufacturing circuit boards includes affixing a conductive material to a base material to form a board media. The method may include cutting one or more vias in the board media in a user-selected arrangement. The method may further include cutting one or more traces in the conductive material to form a user-selected pattern of the one or more traces. The one or more traces may be surrounded by a moat area on the board media. The method may include cutting a high temperature material in the user-selected pattern. The method may include applying the high temperature material to the board material.
Claims15
A method for forming a circuit board, the method comprising:
- drilling one or more holes into a board material having an interior dielectric layer and at least one exterior conductive layer;
- forming one or more vias by inserting a conductive material into the one or more holes;
- forming one or more conductive traces or conductive pads by laser ablating the at least one exterior conductive layer around the one or more conductive traces or conductive pads using a laser;
- applying a covering layer to at least one side of the board material to form a solder mask;
- marking, with the laser, the covering layer to form indicia on the covering layer;
- and
- removing oxidation from the at least one exterior conductive layer by exposing the at least one exterior conductive layer to laser light from the laser.
A method for forming a circuit board, the method comprising:
- drilling one or more holes into a board material having an interior dielectric layer and at least one exterior conductive layer;
- forming one or more vias by inserting a conductive material into the one or more holes and without using photolithography and without using chemical etching;
- forming one or more conductive traces and one or more conductive pads by laser ablating the at least one exterior conductive layer around the one or more conductive traces using a Q-switched laser;
- applying a covering layer to the at least one exterior conductive layer to form a solder mask, the covering layer applied to have one or more openings corresponding with at least one of the one or more conductive pads;
- removing oxidation from the at least one exterior conductive layer by exposing the at least one exterior conductive layer to laser light from the Q-switched laser;
- and
- marking, with the Q-switched laser, the covering layer to form indicia on the covering layer.
Dependencies are inferred from the claim text.