H05K 2201/09354
Ground conductor along edge of main surface
H05K2201/09354 (Ground conductor along edge of main surface) appears on 146 US grants and 153 published applications in this corpus.
Search patents in H05K- Granted patents
- 146
- Published applications
- 153
- Assignees
- 130
- Inventors
- 405
- Latest grant
- 22 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 2 | 0 |
| 1988 | 2 | 0 |
| 1989 | 1 | 0 |
| 1990 | 0 | 0 |
| 1991 | 2 | 0 |
| 1992 | 0 | 0 |
| 1993 | 1 | 0 |
| 1994 | 2 | 0 |
| 1995 | 1 | 0 |
| 1996 | 1 | 0 |
| 1997 | 3 | 0 |
| 1998 | 1 | 0 |
| 1999 | 4 | 0 |
| 2000 | 3 | 0 |
| 2001 | 3 | 0 |
| 2002 | 5 | 6 |
| 2003 | 0 | 6 |
| 2004 | 8 | 6 |
| 2005 | 3 | 8 |
| 2006 | 8 | 8 |
| 2007 | 1 | 10 |
| 2008 | 4 | 12 |
| 2009 | 10 | 9 |
| 2010 | 5 | 8 |
| 2011 | 4 | 5 |
| 2012 | 6 | 4 |
| 2013 | 6 | 5 |
| 2014 | 1 | 6 |
| 2015 | 4 | 8 |
| 2016 | 7 | 2 |
| 2017 | 1 | 6 |
| 2018 | 7 | 5 |
| 2019 | 5 | 4 |
| 2020 | 2 | 8 |
| 2021 | 6 | 5 |
| 2022 | 7 | 1 |
| 2023 | 6 | 5 |
| 2024 | 4 | 9 |
| 2025 | 6 | 3 |
| 2026 | 1 | 4 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- PCB, PCB mounting box, case assembly, and case22 Sep 2026US 12,745,344 B2Zte Corporation
- Electronic device and manufacturing method thereof16 Dec 2025US 12,501,540 B2FUJIFILM Corporation
- Electronic component25 Nov 2025US 12,482,713 B2Murata Manufacturing Co., Ltd.
- Camera module11 Nov 2025US 12,470,792 B2LG Innotek Co., Ltd.
- Circuit board and electronic-component-equipped circuit board4 Nov 2025US 12,464,653 B2Murata Manufacturing Co., Ltd.
- Power semiconductor module23 Jul 2026US 2026/0215273 A1Dynex Semiconductor Limited
- Electronic device including printed circuit board26 Feb 2026US 2026/0059653 A1Samsung Electronics Co., Ltd.
- Camera module12 Feb 2026US 2026/0046501 A1LG Innotek Co., Ltd.
- Printed circuit board assembly for electrostatic discharge protection5 Feb 2026US 2026/0040435 A1Vertiv Corporation
- Multi-structure connector including spark gap10 Apr 2025US 2025/0118911 A1Samsung SDI.Co., Ltd.
Most cited
By later US patents
- Memory card having static electricity protection250US 4,532,419 ASony Corporation · 1985
- Printed circuit board with capacitors connected between ground layer and power layer patterns113US 6,198,362 B1NEC Corporation · 2001
- Low-EMI electronic apparatus, low-EMI circuit board, and method of manufacturing the low-EMI circuit board.101US 6,353,540 B1Hitachi, Ltd. · 2002
- High voltage, low pass filtering connector with multiple ground planes92US 5,493,259 AThe Whitaker Corporation · 1996
- EMI noise cancellation in disk drive having MR read head and single-ended preamplifier67US 6,088,235 AQuantum Corporation · 2000