Electronic device and manufacturing method thereof

A manufacturing method of an electronic device, the method comprising:

• preparing an electronic substrate including a wiring board having a mounting surface, a ground electrode that defines a ground region on the mounting surface, and an electronic component that is located on the mounting surface and is disposed in the ground region;
• forming an insulating protective layer that covers the electronic component in the ground region;
• and
• forming an electromagnetic wave shielding layer that extends over the insulating protective layer and the ground electrode and that covers the insulating protective layer and is electrically connected to the ground electrode, the electromagnetic wave shielding layer being a solidified product of an ink for forming an electromagnetic wave shielding layer, in which a void ratio S1, which is a void ratio of a portion located on the ground electrode, is lower than a void ratio S2, which is a void ratio of a portion located on the insulating protective layer,
• wherein the forming an electromagnetic wave shielding layer includes
• applying a first ink for forming an electromagnetic wave shielding layer to a region that extends over the insulating protective layer and the ground electrode and sintering the first ink for forming an electromagnetic wave shielding layer to form a first layer, and
• applying a second ink for forming an electromagnetic wave shielding layer onto the ground electrode and sintering the second ink for forming an electromagnetic wave shielding layer to form a second layer, in which
• a portion of the first layer located on the ground electrode and the second layer are formed in a mutually laminated disposition, and
• at least one of a sintering temperature for forming the second layer being higher than a sintering temperature for forming the first layer or a sintering time for forming the second layer being longer than a sintering time for forming the first layer is satisfied.