H05K 2201/09309
Core having two or more power planes
Official title: Core having two or more power planes; Capacitive laminate of two power planes
H05K2201/09309 (Core having two or more power planes) appears on 748 US grants and 703 published applications in this corpus.
Search patents in H05K- Granted patents
- 748
- Published applications
- 703
- Assignees
- 310
- Inventors
- 1,389
- Latest grant
- 18 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1980 | 2 | 0 |
| 1981 | 3 | 0 |
| 1982 | 0 | 0 |
| 1983 | 1 | 0 |
| 1984 | 3 | 0 |
| 1985 | 7 | 0 |
| 1986 | 1 | 0 |
| 1987 | 3 | 0 |
| 1988 | 2 | 0 |
| 1989 | 3 | 0 |
| 1990 | 5 | 0 |
| 1991 | 8 | 0 |
| 1992 | 10 | 0 |
| 1993 | 3 | 0 |
| 1994 | 5 | 0 |
| 1995 | 7 | 0 |
| 1996 | 11 | 0 |
| 1997 | 4 | 0 |
| 1998 | 14 | 0 |
| 1999 | 14 | 0 |
| 2000 | 11 | 0 |
| 2001 | 20 | 19 |
| 2002 | 25 | 30 |
| 2003 | 31 | 50 |
| 2004 | 44 | 41 |
| 2005 | 26 | 40 |
| 2006 | 37 | 69 |
| 2007 | 42 | 60 |
| 2008 | 36 | 68 |
| 2009 | 38 | 69 |
| 2010 | 50 | 66 |
| 2011 | 36 | 42 |
| 2012 | 68 | 31 |
| 2013 | 37 | 18 |
| 2014 | 29 | 15 |
| 2015 | 20 | 10 |
| 2016 | 16 | 7 |
| 2017 | 11 | 8 |
| 2018 | 6 | 8 |
| 2019 | 8 | 5 |
| 2020 | 7 | 8 |
| 2021 | 8 | 16 |
| 2022 | 12 | 8 |
| 2023 | 7 | 6 |
| 2024 | 9 | 4 |
| 2025 | 5 | 3 |
| 2026 | 3 | 2 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Structurally enhanced filtering of circuit board planes18 Aug 2026US 12,713,518 B2Microsoft Technology Licensing, LLC
- Bus capacitor of an electronic device, and automobile having same19 May 2026US 12,633,463 B2BYD Company Limited
- Circuit board and electronic assembly7 Apr 2026US 12,598,694 B2Via Labs, Inc.
- Electronic device including wire16 Dec 2025US 12,500,970 B2Samsung Electronics Co., Ltd.
- Laminated unit for printed circuit board and printed circuit board21 Oct 2025US 12,453,005 B1Beijing Zitiao Network Technology Co., Ltd.
- Electronic device including wire16 Apr 2026US 2026/0106925 A1Samsung Electronics Co., Ltd.
- Multi-phase power converter circuit layout to minimize drive loop and power loop inductances29 Jan 2026US 2026/0031717 A1
- Electronic device with an embedded hfac power distribution bus30 Oct 2025US 2025/0337224 A1Energy Research Lab Ltd
- Laminated unit for printed circuit board and printed circuit board9 Oct 2025US 2025/0318049 A1Beijing Zitiao Network Technology Co., Ltd.
- Circuit board and electronic assembly21 Aug 2025US 2025/0267785 A1Via Labs, Inc.
Most cited
By later US patents
- Memory system having synchronous-link DRAM (SLDRAM) devices and controller383US 6,442,644 B1Advanced Memory International, Inc. · 2002
- Passive interposer including at least one passive electronic component225US 5,530,288 AInternational Business Machines Corporation · 1996
- Capacitor laminate for use in capacitive printed circuit boards and methods of manufacture188US 5,079,069 AZycon Corporation · 1992
- Double-sided hybrid high density circuit board and method of making same180US 5,072,075 ADigital Equipment Corporation · 1991
- In situ method for forming a capacitive PCB173US 5,261,153 AZycon Corporation · 1993