Structurally enhanced filtering of circuit board planes

A method, comprising:

• forming a circuit board having a power plane that establishes a pathway for electrical current from power supply circuitry to load circuitry;
• forming the power plane as having a fence region comprising a neckdown of a conductive area having reduced planar width with respect to an adjacent region of the power plane supplying the load circuitry, wherein the fence region is configured to pass DC current carried by the power plane and establish an increased characteristic impedance of the power plane at the fence region with respect to noise having a frequency range with at least a set of vias arrayed across the fence region of the power plane which perforate the power plane and restrict a conductive area of the power plane;
• forming footprints for surface mount capacitors arrayed across the fence region;
• and
• forming additional vias in the circuit board coupling terminals of the surface mount capacitors to the power plane.

An assembly, comprising:

• a circuit board comprising:
• a ground plane formed on a first surface of the circuit board;
• a power plane formed on an internal layer of the circuit board and configured to provide a pathway for electrical current from power supply circuitry to load circuitry, wherein the power plane comprises a fence region comprising a neckdown of a conductive area having reduced planar width with respect to an adjacent region of the power plane supplying the load circuitry, wherein the fence region is configured to pass DC current carried by the power plane and establish an increased characteristic impedance of the power plane at the fence region with respect to noise having a frequency range with at least a set of vias arrayed across the fence region of the power plane which perforate the power plane and restrict a conductive area of the power plane;
• and
• footprints for surface mount capacitors arrayed across the fence region, with first terminals of the footprints coupled through additional vias to the power plane and second terminals of the footprints coupled to the ground plane.