H05K 2201/09318
Core having one signal plane and one power plane
H05K2201/09318 (Core having one signal plane and one power plane) appears on 122 US grants and 137 published applications in this corpus.
Search patents in H05K- Granted patents
- 122
- Published applications
- 137
- Assignees
- 73
- Inventors
- 259
- Latest grant
- 20 May 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 1 | 0 |
| 1990 | 3 | 0 |
| 1991 | 0 | 0 |
| 1992 | 2 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 1 | 0 |
| 1996 | 1 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 1 | 0 |
| 2000 | 4 | 0 |
| 2001 | 0 | 0 |
| 2002 | 2 | 1 |
| 2003 | 2 | 2 |
| 2004 | 1 | 2 |
| 2005 | 2 | 3 |
| 2006 | 4 | 8 |
| 2007 | 4 | 19 |
| 2008 | 9 | 16 |
| 2009 | 8 | 22 |
| 2010 | 10 | 23 |
| 2011 | 13 | 10 |
| 2012 | 14 | 4 |
| 2013 | 12 | 5 |
| 2014 | 3 | 1 |
| 2015 | 3 | 3 |
| 2016 | 3 | 3 |
| 2017 | 5 | 1 |
| 2018 | 2 | 4 |
| 2019 | 4 | 0 |
| 2020 | 2 | 2 |
| 2021 | 0 | 2 |
| 2022 | 1 | 1 |
| 2023 | 1 | 1 |
| 2024 | 1 | 2 |
| 2025 | 2 | 2 |
By publication year. Applications have been published since 2001.
Recent patents
- Mating backplane for high speed, high density electrical connector20 May 2025US 12,309,915 B2Amphenol Corporation
- Method for producing a carrier arrangement8 Apr 2025US 12,273,993 B2Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e. V.
- Mating backplane for high speed, high density electrical connector2 Apr 2024US 11,950,356 B2Amphenol Corporation
- Mating backplane for high speed, high density electrical connector3 Jan 2023US 11,546,983 B2Amphenol Corporation
- Electronic circuit board and electronic circuit device16 Aug 2022US 11,419,208 B2Hitachi Astemo, Ltd.
- Mating backplane for high speed, high density electrical connector6 Nov 2025US 2025/0344316 A1Amphenol Corporation
- Method for producing a carrier arrangement19 Jun 2025US 2025/0203764 A1c/o Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e. V.
- Method for producing a carrier arrangement4 Jul 2024US 2024/0224417 A1Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e. V.
- Mating backplane for high speed, high density electrical connector13 Jun 2024US 2024/0196518 A1Amphenol Corporation
- Mating backplane for high speed, high density electrical connector13 Apr 2023US 2023/0113153 A1Amphenol Corporation
Most cited
By later US patents
- Small outline memory module153US 6,137,709 AIntel Corporation · 2000
- Small outline rambus in-line memory module141US 6,061,263 AIntel Corporation · 2000
- Magnetic disk drive having a suspension mounted transmission line including read and write conductors and a lower conductor121US 7,319,573 B2Hitachi Global Storage Technologies Japan, Ltd. · 2008
- Flexible interconnect cable with grounded coplanar waveguide74US 7,336,139 B2Applied Micro Circuits Corporation · 2008
- Multi-level circuit structure utilizing conductive cores having conductive protrusions and cavities therein58US 5,121,299 AInternational Business Machines Corporation · 1992