Multi-level circuit structure utilizing conductive cores having conductive protrusions and cavities therein

A multi-level circuit card structure comprising:

• a plurality of overlying substrates, each having at least one electrically conductive core, and at least one layer of dielectric material;
• a plurality of imprinted depressions formed within each of said electrically conductive cores and selectively disposed in overlying relationships in each of said electrically conductive cores, each imprinted depression having a convex surface and a concave surface;
• and
• conductive means disposed within said concave surface of selected imprinted depressions within a first of said plurality of substrates and above said convex surface of selected imprinted depressions within a second of said plurality of substrates wherein a portion of one of said electrically conductive cores may be electrically connected with a portion of a second electrically conductive core.