Thermal transfer, management and integrated control structure

A method of making a thermal management and electrical connectivity structure comprising:

• forming on a first side of a photodefinable glass (PDG) substrate a plurality of vias capable of serving as one or more heat conductive vias and at least one of one or more control vias, one or more power vias, and one or more ground vias, by:
• forming a first patterned photoresist layer with one or more first via patterns on the first side of the PDG substrate, exposing the first patterned photoresist layer to a UV energy to activate exposed portions of the PDG substrate, removing the first patterned photoresist layer, and baking the PDG substrate to convert the exposed portions of the PDG substrate to a ceramic phase to form ceramic vias in the PDG substrate;
• forming on a second side of the PDG substrate the one or more heat conductive vias and the at least one of one or more control vias, one or more power vias, and one or more ground vias, by:
• forming a second patterned photoresist layer with the one or more via patterns on the second side of the PDG substrate, wherein the one or more second via patterns on the second side are aligned with the one or more first via patterns on the first side, exposing the second patterned photoresist layer to a UV energy that activates exposed portions of the PDG substrate, removing the second patterned photoresist layer, chemically etching the second side of the PDG substrate to remove the ceramic vias down to a metal plate pattern on the second side of the PDG substrate, depositing a first titanium adhesion layer on the PDG substrate, depositing a copper layer on the first titanium adhesion layer, and electroplating the PDG substrate to fill the one or more heat conductive vias and the at least one of one or more control vias, one or more power vias, and one or more ground vias with copper to form copper vias;
• forming on the first side of the PDG substrate a heat conductive plate by:
• forming a third patterned photoresist layer, and depositing a second titanium adhesion layer on the first side of the PDG substrate;
• depositing a copper layer on the second titanium adhesion layer to form the heat conductive plate and to connect the one or more heat conductive vias formed on the first side to the heat conductive plate on the PDG substrate;
• and
• etching away any remaining ceramic and glass to expose the copper vias and form air cavities therebetween, wherein a glass column surrounds and provides at least one of electrical isolation or mechanical support to the at least one of one or more control vias, one or more power vias, and one or more ground vias.