H05K 2201/09327
Special sequence of power, ground and signal layers in multilayer pcb
Official title: Special sequence of power, ground and signal layers in multilayer PCB
H05K2201/09327 (Special sequence of power, ground and signal layers in multilayer pcb) appears on 146 US grants and 131 published applications in this corpus.
Search patents in H05K- Granted patents
- 146
- Published applications
- 131
- Assignees
- 89
- Inventors
- 320
- Latest grant
- 21 Apr 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 2 | 0 |
| 1986 | 0 | 0 |
| 1987 | 2 | 0 |
| 1988 | 0 | 0 |
| 1989 | 2 | 0 |
| 1990 | 1 | 0 |
| 1991 | 2 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 1 | 0 |
| 1995 | 4 | 0 |
| 1996 | 1 | 0 |
| 1997 | 0 | 0 |
| 1998 | 2 | 0 |
| 1999 | 1 | 0 |
| 2000 | 0 | 0 |
| 2001 | 5 | 0 |
| 2002 | 5 | 1 |
| 2003 | 1 | 2 |
| 2004 | 2 | 0 |
| 2005 | 2 | 6 |
| 2006 | 4 | 4 |
| 2007 | 3 | 7 |
| 2008 | 3 | 3 |
| 2009 | 4 | 5 |
| 2010 | 2 | 1 |
| 2011 | 3 | 4 |
| 2012 | 3 | 1 |
| 2013 | 0 | 1 |
| 2014 | 2 | 4 |
| 2015 | 2 | 19 |
| 2016 | 5 | 1 |
| 2017 | 9 | 7 |
| 2018 | 8 | 8 |
| 2019 | 10 | 7 |
| 2020 | 11 | 12 |
| 2021 | 11 | 8 |
| 2022 | 7 | 10 |
| 2023 | 8 | 5 |
| 2024 | 9 | 3 |
| 2025 | 7 | 7 |
| 2026 | 1 | 5 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
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Most cited
By later US patents
- Thick film multilayer substrate185US 4,328,531 AHitachi, Ltd. · 1982
- Printed circuit board (PCB) including channeled capacitive plane structure157US 5,912,809 ADell USA, L. P. · 1999
- Multilayer printed circuit board and method for fabricating same109US 5,451,721 AInternational Business Machines Corporation · 1995
- Multilayer printed wiring board with plurality of ground layers forming separate ground planes106US 5,719,750 AMitsubishi Denki Kabushiki Kaisha · 1998
- Digital signal processing assembly and test method81US 6,181,004 B22001