Printed circuit board (PCB) including channeled capacitive plane structure

A method of fabricating a printed circuit board comprising the steps of:

• laying out a plurality of planar conductive layers including a power plane layer for supplying operating power throughout the planar conductive layers;
• laying out a power plane layer including a plurality of separated segments in selected geometric patterns;
• laying out a plurality of planar insulative layers having variable and controlled widths;
• controlling the geometric patterns and the insulative layer variable width to control VHF electrical currents in three dimensions;
• forming a plurality of planar conductive layers arranged in a mutually parallel sequence;
• forming a plurality of planar insulative layers separating the plurality of planar conductive layers, the planar insulative layers having the variable and controlled widths;
• laying out the plurality of planar conductive layers to include a plurality of signal plane layers for communicating operational signals throughout the planar conductive layers;
• laying out the plurality of signal plane layers to include a plurality of separated channeled capacitive plane segments in selected geometric patterns;
• and
• controlling the geometric patterns in the channeled capacitive plane segments, the geometric patterns in the power plane layer, and the insulative layer variable width to determine electrical currents in three dimensions.

A computer system comprising:

• a plurality of integrated circuit chips including a processor;
• a printed circuit board for mounting at least some of the plurality of integrated circuit chips, the printed circuit board including:
• a plurality of planar conductive layers arranged in a mutually parallel sequence;
• and
• a plurality of planar insulative layers separating the plurality of planar conductive layers, the planar insulative layers having variable and controlled widths;
• the plurality of planar conductive layers including a power plane layer for supplying operating power throughout the planar conductive layers;
• the power plane layer including a plurality of separated segments in selected geometric patterns;
• the plurality of planar conductive layers including a plurality of signal plane layers for communicating operational signals throughout the planar conductive layers;
• the plurality of signal plane layers including a plurality of separated channeled capacitive plane segments in selected geometric patterns;
• and
• the geometric patterns in the channeled capacitive plane segments, the geometric patterns in the power plane layer, and the insulative layer variable width being controlled to control VHF electrical currents in three dimensions.