Multilayer printed circuit board and method for fabricating same
AssigneeInternational Business Machines Corporation
InventorsYutaka Tsukada, Shuhei Tsuchida
Life of this patent
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Abstract
A multilayer printed circuit board and a corresponding fabrication method are disclosed, which circuit board achieves a relatively high degree of wiring density and a relatively high degree of wiring design freedom. These advantages are obtained in the inventive printed circuit board by electrically connecting power conductors or ground conductors using through holes. On the other hand, signal conductors in any two adjacent signal wiring layers are electrically connected using via holes extending only through an intervening electrically insulating layer. Preferably, the electrically insulating layer is a layer of photosensitive resin and the via holes are formed using conventional photolithographic techniques.
Claims16
A multilayer printed circuit board, comprising:
- an electrically insulating substrate, including first and second surfaces;
- a first electrically conductive region, overlying said first surface of said electrically insulating substrate, to which electrical power or a ground potential is to be applied;
- at least first and second wiring layers, separated by an electrically insulating layer, overlying said second surface of said electrically insulating substrate, said first and second wiring layers including at least, respectively, first and second signal wiring conductors which are electrically connected to each other through a via hole, containing electrically conductive material, extending through said electrically insulating layer, there being no through hole electrical connections between said signal wiring conductors overlying said second surface and electrical conductors overlying said first surface, said second wiring layer, which overlies said first wiring layer, also including a second electrically conductive region intended to be electrically connected to said first electrically conductive region;
- and
- a through hole, containing electrically conductive material, extending through said first electrically conductive region, said electrically insulating substrate, said first wiring layer, said electrically insulating layer, and said second wiring layer, said electrically conductive material in said through hole serving to electrically connect said first electrically conductive region to said second electrically conductive region.
A multilayer printed circuit board, comprising:
- an electrically insulating substrate, including first and second surfaces;
- at least first and second wiring layers, separated by a first electrically insulating layer, overlying said first surface, said first and second wiring layers including at least, respectively, first and second signal wiring conductors which are electrically connected to each other through a first via hole, containing electrically conductive material, extending through said first electrically insulating layer, said first wiring layer, which overlies said second wiring layer, also including a first electrically conductive region to which electrical power or a ground potential is to be applied;
- at least third and fourth wiring layers, separated by a second electrically insulating layer, overlying said second surface, said third and fourth wiring layers including at least, respectively, third and fourth signal wiring conductors which are electrically connected to each other through a second via hole, containing electrically conductive material, extending through said second electrically insulating layer, there being no through hole electrical connections between signal wiring conductors overlying said second surface and signal wiring conductors overlying said first surface, said fourth wiring layer, which overlies said third wiring layer, also including a second electrically conductive region intended to be electrically connected to said first electrically conductive region;
- and
- a through hole, containing electrically conductive material, extending through said first wiring layer, said first electrically insulating layer, said second wiring layer, said electrically insulating substrate, said third wiring layer, said second electrically insulating layer and said fourth wiring layer, said electrically conductive material in said through hole serving to electrically connect said first electrically conductive region to said second electrically conductive region.
Dependencies are inferred from the claim text.