Multilayer wiring board and electronic device including the same
AssigneeFujitsu Limited
InventorRyo Kikuchi
Life of this patent
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AssigneeFujitsu Limited
InventorRyo Kikuchi
Estimating the term…
A multilayer wiring board has a first signal layer and ground layers, and includes a first differential wiring provided in the first signal layer and including first and second wirings, a first another signal line provided on the first signal layer, a signal via extending along the stacking direction and electrically connected to the first another signal line, and a ground via extending along a stacking direction and electrically connected to the ground layers. The first differential wiring includes a first portion, a second portion continuous with the first portion, and a third portion continuous with the second portion, the first wiring being disposed between the ground via and the signal via adjacent to the ground via, the second wiring being disposed on an opposite side of the first wiring across the ground via, and the ground via being sandwiched between the first and second wirings.
A multilayer wiring board having at least a first signal layer and a plurality of ground layers along a stacking direction, the multilayer wiring board comprising:
An electronic device comprising:
Dependencies are inferred from the claim text.