Multilayer printed wiring board with plurality of ground layers forming separate ground planes
AssigneeMitsubishi Denki Kabushiki Kaisha
InventorYasushi Iwane
Life of this patent
Estimating the term…
Abstract
A printed board 10 is provided with two ground layers 3a, 3b. These ground layers 3a, 3b are electrically insulated inside the printed board. By connecting circuits with different characteristics (low frequency and high frequency, for example) with the different ground layers 3a, 3b, interference of these circuits caused due to a common ground can be minimized.
Claims12
A multilayer printed wiring board, with various components mounted thereon being electrically connected by printed wiring on a plurality of layers comprising:
- at least two separate ground layers positioned within the board in vertically spaced, horizontally overlapping relationship to each other and electrically insulated from each other for enabling connection of different components mounted on the board to different ones of said at least two separate ground layers, whereby the ground connections of said different components which are connected to separate ones of said ground layers are electrically insulated from each other.
A multilayer printed wiring board device which has a plurality of multilayer printed wiring boards, each multilayer printed wiring board, with various components mounted thereon being electrically connected by printed wiring on a plurality of layers comprising at least two separate ground layers positioned within the board in vertically spaced, horizontally overlapping relationship to each other and electrically insulated from each other for enabling connection of different components mounted on each board to different ones of said at least two separate ground layers, whereby the ground connections of said different components which are connected to separate ones of said ground layers in each board are electrically insulated from each other, the at least two ground layers on one multilayer printed wiring board being separately connected to the at least two ground layers on another board.
A multilayer printed wiring board, with various components mounted thereon being electrically connected by printed wiring on a plurality of layers, comprising:
- at least two ground layers positioned within the board in vertically spaced, horizontally overlapping relationship to each other and electrically insulated from each other for enabling connection of different components mounted on each board to different ones of said at least two separate ground layers, and a connecting member to connect the ground layers at a single point close to a ground terminal for connection with an external ground line.
A multilayer printed wiring board, with various components mounted thereon being electrically connected by printed wiring on a plurality of layers comprising:
- separate ground layers in the printed wiring being divided into at least two ground sections positioned within the board in vertically spaced, horizontally overlapping relationship to each other and which are electrically insulated from each other and connected by a capacitor.
A multilayer printed wiring board, with various components mounted thereon being electrically connected by printed wiring on a plurality of layers comprising:
- separate ground layers in the printed wiring being divided into at least two ground sections positioned within the board in vertically spaced, horizontally overlapping relationship to each other and which are electrically insulated from each other and connected by an inductor.
Dependencies are inferred from the claim text.