H05K 2201/09218
Conductive traces
H05K2201/09218 (Conductive traces) appears on 2,850 US grants and 3,138 published applications in this corpus.
Search patents in H05K- Granted patents
- 2,850
- Published applications
- 3,138
- Assignees
- 1,080
- Inventors
- 5,883
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 1 | 0 |
| 1978 | 0 | 0 |
| 1979 | 2 | 0 |
| 1980 | 1 | 0 |
| 1981 | 1 | 0 |
| 1982 | 5 | 0 |
| 1983 | 2 | 0 |
| 1984 | 2 | 0 |
| 1985 | 4 | 0 |
| 1986 | 6 | 0 |
| 1987 | 9 | 0 |
| 1988 | 10 | 0 |
| 1989 | 9 | 0 |
| 1990 | 8 | 0 |
| 1991 | 8 | 0 |
| 1992 | 4 | 0 |
| 1993 | 7 | 0 |
| 1994 | 14 | 0 |
| 1995 | 16 | 0 |
| 1996 | 15 | 0 |
| 1997 | 14 | 0 |
| 1998 | 26 | 0 |
| 1999 | 26 | 0 |
| 2000 | 48 | 0 |
| 2001 | 55 | 22 |
| 2002 | 62 | 46 |
| 2003 | 62 | 74 |
| 2004 | 61 | 86 |
| 2005 | 61 | 109 |
| 2006 | 85 | 130 |
| 2007 | 91 | 134 |
| 2008 | 98 | 130 |
| 2009 | 79 | 147 |
| 2010 | 97 | 114 |
| 2011 | 108 | 82 |
| 2012 | 96 | 78 |
| 2013 | 71 | 78 |
| 2014 | 67 | 128 |
| 2015 | 99 | 127 |
| 2016 | 108 | 109 |
| 2017 | 133 | 128 |
| 2018 | 116 | 157 |
| 2019 | 168 | 145 |
| 2020 | 144 | 181 |
| 2021 | 137 | 203 |
| 2022 | 151 | 135 |
| 2023 | 131 | 164 |
| 2024 | 133 | 123 |
| 2025 | 125 | 117 |
| 2026 | 73 | 191 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
- H05K 2201/09236Parallel layoutIndexing code1,102
- H05K 2201/09227Layout details of a plurality of tracesIndexing code726
- H05K 2201/09263MeanderIndexing code693
- H05K 2201/09254Branched layoutIndexing code285
- H05K 2201/09245Crossing layoutIndexing code233
- H05K 2201/09272Layout details of angles or cornersIndexing code163
- H05K 2201/09281Layout details of a single conductorIndexing code146
Recent patents
- Flexible printed circuit to suspension soldering improvement6 Oct 2026US 12,757,332 B2Western Digital Technologies, Inc.
- Method and apparatus for surface mount connections8 Sep 2026US 12,731,922 B2Ciena Corporation
- Stretchable substrate, and method for manufacturing stretchable substrate8 Sep 2026US 12,733,091 B2Korea Photonics Technology Institute
- Printed wiring board8 Sep 2026US 12,733,101 B2Sumitomo Electric Printed Circuits, Inc.
- Jump-fusing and tailored PCB system for loop inductance reduction8 Sep 2026US 12,733,513 B2Texas Instruments Incorporated
- Stepped trace design for impedance compensation of high-speed differential pair channels8 Oct 2026US 2026/0313784 A1Advanced Micro Devices, Inc.
- Printed wiring board1 Oct 2026US 2026/0304599 A1Sumitomo Electric Industries, Ltd.
- Overlapped interconnect with enhanced design1 Oct 2026US 2026/0304601 A1Micron Technology, Inc.
- Substrate and electronic device24 Sep 2026US 2026/0292970 A1Kioxia Corporation
- Integrated circuit packages having partial pad vertical interconnect access24 Sep 2026US 2026/0292981 A1Intel Corporation
Most cited
By later US patents
- Memory system having synchronous-link DRAM (SLDRAM) devices and controller383US 6,442,644 B1Advanced Memory International, Inc. · 2002
- Low cross talk electrical connector system319US 5,299,956 ASuperior Modular Products Incorporated · 1994
- Apparatus for interconnecting multiple devices on a circuit board247US 6,434,016 B1Intel Corporation · 2002
- Flexible printed circuit with removable testing portion238US 9,717,141 B1St. Jude Medical, Atrial Fibrillation Division, Inc. · 2017
- Connector cross-talk compensation231US 5,700,167 ALucent Technologies Inc. · 1997