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US 12,733,101 B2Granted
Printed wiring board
AssigneeSumitomo Electric Printed Circuits, Inc.
InventorsMichi Ogata, Kou Noguchi
Life of this patent
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Abstract
The printed wiring board according to an embodiment of the present disclosure comprises: a substrate; a first wiring layer having a first wiring that is disposed directly or indirectly on the substrate; and a second wiring layer having a second wiring that is disposed directly or indirectly on the substrate. The average wire width of the first wiring is 40 μm or less, and the average wire width of the second wiring is 50 μm or more.
Claims11
A printed wiring board comprising:
- a substrate;
- a first wiring layer including a first wiring line directly or indirectly disposed on the substrate;
- and
- a second wiring layer including a second wiring line directly or indirectly disposed on the substrate,
- wherein the first wiring layer is a layer formed by a semi-additive method,
- wherein the second wiring layer is a layer formed by a subtractive method,
- wherein an average line width of the first wiring line is 40 μm or less,
- wherein an average line width of the second wiring line is 50 μm or more, and
- wherein a cross-sectional shape of the second wiring line, the cross-sectional shape being perpendicular to an axial direction of the second wiring line, is tapered from the substrate toward an end portion of the second wiring line.
6 more elements
Dependencies are inferred from the claim text.