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US 6,434,016 B1Granted
Apparatus for interconnecting multiple devices on a circuit board
AssigneeIntel Corporation
InventorsMing Zeng, Sanjay Dabral
Life of this patent
Estimating the term…
Abstract
A method and apparatus interconnecting multiple devices on a circuit board. One disclosed circuit board has a first attach region on a first surface for coupling a first set of pins from a first device to a set of signal lines. A second attach region on a second surface is for coupling a second set of pins from a second device to the set of signal lines. The second attach region is predominantly non-overlapping with respect to the first attach region.
Claims20
An apparatus comprising:
- a circuit board having a plurality of signal lines, said circuit board having a first side and a second side;
- a first device coupled to said first side and having a first plurality of signal interfaces coupled to a plurality of signal lines;
- a second device coupled to said second side and having a second plurality of signal interfaces coupled to said plurality of signal lines, said second device being attached in an at least partially non-overlapping manner with respect to the first device, said plurality of signal lines providing at least a minimum offset between said first plurality of signal interfaces and said second plurality of signal interfaces.
An apparatus comprising:
- a circuit board having a plurality of signal lines for a first type of signal;
- a plurality of electronic devices in a staggered and non-overlapping arrangement on opposite sides of said circuit board, each of said plurality of electronic devices having a set of a first type of signal interfaces coupled to the plurality of signal lines, each of the plurality of signal lines have at least a minimum length between connections to the plurality of electronic devices.
A circuit board comprising:
- a plurality of signal lines;
- a first attach region on a first surface of said circuit board, said first attach region for coupling a first plurality of signal interfaces from a first processing device to the plurality of signal lines;
- a second attach region on a second surface of said circuit board, said second attach region for coupling a second plurality of signal interfaces from a second processing device to said plurality of signal lines, said second attach region being non-overlapping with respect to said first attach region, said plurality of signal lines providing at least a minimum offset between said first plurality of signal interfaces and said second plurality of signal interfaces.
An apparatus comprising:
- a circuit board having a plurality of signal lines for a plurality of source synchronous signals;
- a first processor mounted on a first side of the first circuit board, the first processor having a first plurality of source synchronous signal interfaces coupled to the plurality of signal lines;
- a second processor mounted on a second side of the first circuit board, the second processor having a second plurality of source synchronous signal interfaces coupled to the plurality of signal lines, the second processor being mounted in a non-overlapping manner with respect to the first processor, the plurality of signal lines providing at least a minimum offset between the first plurality of source synchronous signal interfaces and corresponding ones of the second plurality of source synchronous signal interfaces.
Dependencies are inferred from the claim text.