Overlapped interconnect with enhanced design
AssigneeMicron Technology, Inc.
InventorJon Karsten Klarqvist
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Abstract
Systems, apparatuses, and methods related to an interconnect between an electrical component and a printed circuit board are described. Embodiments of the present technology can include swirling the traces connected the interconnect according to a turn pattern. For example, a printed circuit board trace and a component trace are swirled by a half turn or full turn before connecting to the interconnect. Swirling the traces can generate an inductance which compensates the effects of the capacitance at the interface interconnect.
Claims20
An electronic device comprising:
- a printed circuit board including a first trace;
- a component mounted on the printed circuit board and including a second trace,
- wherein the first trace and the second trace are connected by an interconnect,
- wherein the first trace is constructed with a first turn pattern,
- wherein the second trace is constructed with a second turn pattern, and
- wherein the first turn pattern of the first trace and the second turn pattern of the second trace generate an inductance at the interconnect to compensate a capacitance at the interconnect.
A memory device comprising:
- a semiconductor substrate;
- a trace on the semiconductor substrate,
- wherein the trace on the semiconductor substrate is constructed with a turn pattern leading to a termination point, and
- wherein the turn pattern of the trace on the semiconductor substrate is configured to generate an inductance at the termination point to compensate a capacitance at the termination point, when the termination point is vertically connected to a coupled trace that is vertically offset from the trace on the semiconductor substrate.
A method for controlling a capacitance at an interconnect between a printed circuit board and a component, the method comprising:
- determining a capacitance value of the capacitance at the interconnect between the printed circuit board and the component, wherein a first trace of the printed circuit board and a second trace of the component connect to the interconnect;
- and
- determining a first turn pattern for the first trace and a second turn pattern for the second trace based on the capacitance value, wherein the first turn pattern and the second turn pattern generate an inductance at the interconnect to compensate the capacitance at the interconnect.
Dependencies are inferred from the claim text.