Integrated circuit packages having partial pad vertical interconnect access

A printed circuit board, comprising:

• a first surface and an opposing second surface;
• a through hole with sidewalls including a first conductive material extending from the first surface to the second surface, the through hole having a circumference of 360 degrees;
• a second conductive material, at the first surface, coupled to the first conductive material in the through hole and extending outwards from the through hole, wherein the second conductive material extends a first distance around the circumference of the through hole and the first distance is less than the circumference of the through hole;
• and
• a third conductive material, at the second surface, coupled to the first conductive material in the through hole and extending outwards from the through hole, wherein the third conductive material extends a second distance around the circumference of the through hole and the second distance is less than the circumference of the through hole and is different than the first distance.

An electronic assembly, comprising:

• a substrate, having a first surface and an opposing second surface, comprising:
• a plated through hole (PTH) via extending from the first surface to the second surface, the PTH via having a circumference of 360 degrees;
• and
• a via pad, at the first surface, coupled to the PTH via, wherein the via pad extends less than 360 degrees around the circumference of the PTH via;
• and
• a semiconductor device coupled to the first surface of the substrate.