H05K 2201/09372
Pads and lands
H05K2201/09372 (Pads and lands) appears on 3,429 US grants and 3,490 published applications in this corpus.
Search patents in H05K- Granted patents
- 3,429
- Published applications
- 3,490
- Assignees
- 1,095
- Inventors
- 7,006
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 3 | 0 |
| 1977 | 7 | 0 |
| 1978 | 6 | 0 |
| 1979 | 1 | 0 |
| 1980 | 1 | 0 |
| 1981 | 5 | 0 |
| 1982 | 2 | 0 |
| 1983 | 5 | 0 |
| 1984 | 4 | 0 |
| 1985 | 8 | 0 |
| 1986 | 11 | 0 |
| 1987 | 13 | 0 |
| 1988 | 16 | 0 |
| 1989 | 26 | 0 |
| 1990 | 10 | 0 |
| 1991 | 26 | 0 |
| 1992 | 19 | 0 |
| 1993 | 18 | 0 |
| 1994 | 28 | 0 |
| 1995 | 44 | 0 |
| 1996 | 43 | 0 |
| 1997 | 44 | 0 |
| 1998 | 54 | 0 |
| 1999 | 67 | 0 |
| 2000 | 79 | 0 |
| 2001 | 97 | 48 |
| 2002 | 118 | 121 |
| 2003 | 107 | 124 |
| 2004 | 108 | 132 |
| 2005 | 89 | 145 |
| 2006 | 113 | 170 |
| 2007 | 111 | 181 |
| 2008 | 131 | 236 |
| 2009 | 105 | 206 |
| 2010 | 131 | 157 |
| 2011 | 132 | 132 |
| 2012 | 139 | 92 |
| 2013 | 108 | 104 |
| 2014 | 81 | 122 |
| 2015 | 113 | 132 |
| 2016 | 90 | 91 |
| 2017 | 137 | 106 |
| 2018 | 108 | 106 |
| 2019 | 113 | 119 |
| 2020 | 116 | 139 |
| 2021 | 118 | 126 |
| 2022 | 117 | 160 |
| 2023 | 98 | 156 |
| 2024 | 112 | 135 |
| 2025 | 109 | 127 |
| 2026 | 88 | 123 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
- H05K 2201/09472Recessed pad for surface mountingIndexing code644
- H05K 2201/094Array of pads or lands differing from one anotherIndexing code603
- H05K 2201/09481Via in padIndexing code564
- H05K 2201/09381Shape of non-curved single flat metallic pad, land or exposed part thereofIndexing code547
- H05K 2201/09409Multiple rows of pads, lands, terminals or dummy patternsIndexing code434
- H05K 2201/09418Special orientation of pads, lands or terminals of componentIndexing code253
- H05K 2201/0949Pad close to a hole, not surrounding the holeIndexing code198
- H05K 2201/09427Special relation between the location or dimension of a pad or landIndexing code186
All 13 subgroupsShow fewer
- H05K 2201/09436Pads or lands on permanent coating which covers the other conductorsIndexing code165
- H05K 2201/09445Pads for connections not located at the edge of the pcbIndexing code158
- H05K 2201/09454Inner lands, i.e. lands around via or plated through-hole in internal layerIndexing code149
- H05K 2201/0939Curved padsIndexing code119
- H05K 2201/09463Partial lands, i.e. lands or conductive rings not completely surrounding the holeIndexing code45
Recent patents
- Circuit board and electronic device6 Oct 2026US 12,757,322 B2Shenzhen Jufei Optoelectronics Co., Ltd.
- Method and apparatus for surface mount connections8 Sep 2026US 12,731,922 B2Ciena Corporation
- Printed circuit board8 Sep 2026US 12,733,094 B2Samsung Electro-Mechanics Co., Ltd.
- Printed wiring board8 Sep 2026US 12,733,101 B2Sumitomo Electric Printed Circuits, Inc.
- Circuit board with reflective layers having hollows, and an electronic apparatus1 Sep 2026US 12,727,076 B2Boe Technology Group Co., Ltd.
- Printed circuit board8 Oct 2026US 2026/0313787 A1Samsung Electro-Mechanics Co., Ltd.
- Circuit board and semiconductor package comprising same8 Oct 2026US 2026/0313791 A1LG Innotek Co., Ltd.
- Printed circuit board8 Oct 2026US 2026/0313794 A1Samsung Electro-Mechanics Co., Ltd.
- Semiconductor storage device8 Oct 2026US 2026/0313798 A1Kioxia Corporation
- Wiring substrate and method for manufacturing wiring substrate8 Oct 2026US 2026/0313802 A1Ibiden Co., Ltd.
Most cited
By later US patents
- Encapsulated semiconductor device package having holes for electrically conductive material423US 5,608,265 AHitachi, Ltd. · 1997
- Method for fabricating semiconductor components using focused laser beam321US 6,114,240 AMicron Technology, Inc. · 2000
- Pad array semiconductor device264US 5,592,025 AMotorola, Inc. · 1997
- Parallel process interposer (PPI)263US 5,404,044 AInternational Business Machines Corporation · 1995
- Method for fabricating a semiconductor interconnect with laser machined electrical paths through substrate256US 6,107,109 AMicron Technology, Inc. · 2000