H05K 2201/09427
Special relation between the location or dimension of a pad or land
Official title: Special relation between the location or dimension of a pad or land and the location or dimension of a terminal
H05K2201/09427 (Special relation between the location or dimension of a pad or land) appears on 186 US grants and 228 published applications in this corpus.
Search patents in H05K- Granted patents
- 186
- Published applications
- 228
- Assignees
- 133
- Inventors
- 537
- Latest grant
- 1 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 1 | 0 |
| 1990 | 0 | 0 |
| 1991 | 1 | 0 |
| 1992 | 2 | 0 |
| 1993 | 1 | 0 |
| 1994 | 0 | 0 |
| 1995 | 1 | 0 |
| 1996 | 1 | 0 |
| 1997 | 3 | 0 |
| 1998 | 4 | 0 |
| 1999 | 3 | 0 |
| 2000 | 1 | 0 |
| 2001 | 5 | 5 |
| 2002 | 4 | 10 |
| 2003 | 2 | 4 |
| 2004 | 8 | 4 |
| 2005 | 4 | 7 |
| 2006 | 5 | 8 |
| 2007 | 4 | 11 |
| 2008 | 1 | 9 |
| 2009 | 2 | 11 |
| 2010 | 5 | 6 |
| 2011 | 11 | 8 |
| 2012 | 4 | 4 |
| 2013 | 6 | 11 |
| 2014 | 4 | 9 |
| 2015 | 7 | 14 |
| 2016 | 9 | 8 |
| 2017 | 15 | 9 |
| 2018 | 9 | 9 |
| 2019 | 8 | 11 |
| 2020 | 5 | 10 |
| 2021 | 10 | 9 |
| 2022 | 8 | 15 |
| 2023 | 9 | 9 |
| 2024 | 13 | 6 |
| 2025 | 5 | 13 |
| 2026 | 4 | 8 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Display device1 Sep 2026US 12,727,083 B2Samsung Display Co., Ltd.
- Flexible printed circuit board, wiring module, flexible printed circuit board including terminal, and power storage module30 Jun 2026US 12,672,241 B2Autonetworks Technologies, Ltd.
- Printed circuit board having lead pads that accommodate offset electronic component leads31 Mar 2026US 12,593,406 B2SanDisk Technologies LLC
- Circuit board and circuit module27 Jan 2026US 12,538,422 B2Murata Manufacturing Co., Ltd.
- Display device and method of manufacturing the same26 Aug 2025US 12,402,257 B2Samsung Display Co., Ltd.
- Circuit board24 Sep 2026US 2026/0292980 A1LG Innotek Co., Ltd.
- Wiring board17 Sep 2026US 2026/0282222 A1KYOCERA Corporation
- Means to improve the thermal performance of a printed electronics led light source13 Aug 2026US 2026/0239524 A1Signify Holding B. V.
- Methods and apparatus to enable attachment of surface mount technology (smt) components of different sizes to an underlying substrate13 Aug 2026US 2026/0239532 A1Intel Corporation
- Via assembly for printed circuit board18 Jun 2026US 2026/0173255 A1Cisco Technology, Inc.
Most cited
By later US patents
- Ultra-small LED electrode assembly and method for manufacturing same114US 9,773,761 B2Psi Co., Ltd. · 2017
- Electronic structures having a joining geometry providing reduced capacitive loading90US 5,471,090 AInternational Business Machines Corporation · 1995
- Electronic circuit device89US 5,684,677 AKabushiki Kaisha Toshiba · 1997
- Method of mounting an electronic part with bumps on a circuit board88US 5,489,750 AMatsushita Electric Industrial Co., Ltd. · 1996
- Method for connecting electronic components to a substrate, and a method for checking such a connection60US 6,678,948 B1Robert Bosch GmbH · 2004