Circuit board and circuit module
AssigneeMurata Manufacturing Co., Ltd.
InventorTakashi Kitahara
Life of this patent
Estimating the term…
Abstract
A circuit board includes a grounding land conductor that is provided on a first main surface of a base material, and overlaps with a region in which an electronic component of a bump connection type is mounted, when viewed in a direction perpendicular to the first main surface. The grounding land conductor includes a mounting pad portion on which a bump of the electronic component is mounted, a common portion that overlaps with the electronic component, when viewed in the direction perpendicular to the main surface, and a connecting portion that connects the mounting pad portion and the common portion and is smaller in width than the mounting pad portion.
Claims20
A circuit board comprising:
- an insulating base material including a first main surface;
- and
- a plurality of land conductors provided on the first main surface, wherein:
- the plurality of land conductors include a grounding land conductor overlapping with a region in which a first electronic component of a bump connection type is mounted, when viewed in a direction perpendicular to the first main surface;
- and
- the grounding land conductor includes:
- a mounting pad portion on which a bump of the first electronic component is mounted;
- a common portion overlapping with the first electronic component, when viewed in the direction perpendicular to the first main surface;
- and
- a connecting portion connecting the mounting pad portion and the common portion and being narrower in width than the mounting pad portion, and
- the mounting pad portion is arranged on an outer edge of the common portion.
Dependencies are inferred from the claim text.