Method for connecting electronic components to a substrate, and a method for checking such a connection

A method for examining a connection between an electronic component and a carrier substrate, pads of the electronic component being connected to assigned pads of the carrier substrate via at least one solder bump, comprising the steps of:

• after connection of the electronic component to the carrier substrate, exposing a bonding arrangement to x-rays directed perpendicularly to a contacting plane;
• making a radiograph on a side of the bonding arrangement facing away from an x-ray source;
• and
• analyzing an intensity variation of the x-rays in a transitional region from a solder bump to a region surrounding the solder bump, the solder bump being deformed during soldering so that one of a continuous transition of the intensity variation from a minimum intensity to a maximum intensity and a set deformation of the solder bump is measurable when proper wetting of the assigned pads has taken place.