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US 2026/0292980 A1Published application
Circuit board
AssigneeLG Innotek Co., Ltd.
InventorsJae Woong CHOI, Yu Lim Choe, Bung Suek Oh
Life of this patent
Estimating the term…
Abstract
The present embodiment relates to a circuit board. The circuit board according to one aspect of the present invention comprises: an insulating layer; a pad portion disposed on the insulating layer; and a bonding portion disposed on the pad portion, wherein a concave portion of concave shape is disposed on the upper surface of the bonding portion, and the concave portion is disposed eccentrically relative to the center of the bonding portion.
Claims20
A circuit board, comprising:
- an insulating layer;
- a pad portion disposed on the insulating layer;
- a protective layer disposed on the pad portion;
- and
- a bonding portion disposed on the pad portion,
- wherein the protective layer includes a hole penetrated in the vertical direction,
- wherein the bonding portion includes a through portion disposed in the hole and a protrusion disposed on the through portion and having a width greater than a width of the through portion, and
- wherein the width of the through portion is within the range of 50% or more to 90% or less of the width of the protrusion.
5 more elements
A circuit board, comprising:
- a build-up insulating portion including multiple insulating layers stacked in the vertical direction;
- a pad portion disposed on the build-up insulating portion;
- a protective layer disposed on the pad portion;
- a bonding portion disposed on the protective layer and connected to the pad portion by penetrating the protective layer;
- and
- a plurality of via electrodes disposed on the underside of the pad portion and penetrating at least a portion of the build-up insulating portion, wherein the bonding portion includes a through portion overlapping the protective layer in the horizontal direction and a protrusion disposed on the protective layer,
- wherein a horizontal width of the through portion is at least 50% and at most 90% of a horizontal width of the protrusion, and
- wherein at least some of the plurality of via electrodes are vertically overlapped with the pad portion, the protective layer, and the protrusion.
5 more elements
Dependencies are inferred from the claim text.