Printed circuit board having lead pads that accommodate offset electronic component leads
AssigneeSanDisk Technologies LLC
InventorsChoong Keat Loh, Chii Jian Saw, Chun Yan Koay, Soon Chai Tee
Life of this patent
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Abstract
A printed circuit board (PCB) includes lead pads that are shaped and sized to account for offset leads of an electronic component, such as a capacitor. A proximal end of the lead pad has a first dimension and a distal end of the lead pad has a second dimension that is larger than the first dimension. The larger width of the proximal end of the lead pad accommodates offset leads and helps ensure lead joint integrity. The narrower width of the proximal end prevents solder from overflowing onto other areas on the PCB.
Claims20
A printed circuit board (PCB) for a semiconductor package, comprising:
- an opening defined in a planar surface of the PCB, the opening for receiving an electronic component;
- and
- a plurality of lead pads proximate to the opening, each of the plurality of lead pads for receiving respective leads of the electronic component and having a first width at a proximal end and a second, larger width at a distal end.
A semiconductor package, comprising:
- a printed circuit board (PCB) defining an opening;
- a first lead pad proximate the opening and having a proximal end and a distal end, the proximal end extending from the opening and having a first dimension and the distal end having a second dimension that is larger than the first dimension;
- and
- a second lead pad proximate the opening and having a proximal end and a distal end, the proximal end extending from the opening and having the first dimension and the distal end having the second dimension.
A printed circuit board (PCB) for a semiconductor package, comprising:
- an electronic component receiving means defined in a planar surface of the PCB;
- a first electronic component lead receiving means proximate the electronic component receiving means, the first electronic component lead receiving means having a shape in which a proximal end of the first electronic component lead receiving means has a first width and a distal end of the first electronic component lead receiving means has a second width that is larger than the first width;
- and
- a second electronic component lead receiving means proximate the electronic component receiving means, the second electronic component lead receiving means having a shape in which a proximal end of the second electronic component lead receiving means has the first width and a distal end of the second electronic component lead receiving means has the second width.
Dependencies are inferred from the claim text.