Wiring board
AssigneeKYOCERA Corporation
InventorJunpei KAWASE
Life of this patent
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AssigneeKYOCERA Corporation
InventorJunpei KAWASE
Estimating the term…
To reduce the possibility of being affected by electromagnetic noise in signal transmission. A wiring board of an aspect of the present disclosure includes a substrate including a first surface, a second surface, and a lateral surface, a plurality of first connection terminals located on the first surface, a plurality of first external terminals located on the second surface, a plurality of first wiring conductors located inside the substrate and configured to connect the first connection terminals and the first external terminals, a first conductor connected to each of the plurality of first wiring conductors and extending from an inside of the substrate to the lateral surface, a first metal body located inside the substrate independently of the first wiring conductors, and a second conductor connected to the first metal body and extending from the inside of the substrate to the lateral surface.
A wiring board comprising:
Dependencies are inferred from the claim text.