H05K 2201/09445
Pads for connections not located at the edge of the pcb
Official title: Pads for connections not located at the edge of the PCB, e.g. for flexible circuits
H05K2201/09445 (Pads for connections not located at the edge of the pcb) appears on 158 US grants and 173 published applications in this corpus.
Search patents in H05K- Granted patents
- 158
- Published applications
- 173
- Assignees
- 127
- Inventors
- 402
- Latest grant
- 9 Jun 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 1 | 0 |
| 1987 | 3 | 0 |
| 1988 | 1 | 0 |
| 1989 | 4 | 0 |
| 1990 | 1 | 0 |
| 1991 | 0 | 0 |
| 1992 | 1 | 0 |
| 1993 | 1 | 0 |
| 1994 | 1 | 0 |
| 1995 | 2 | 0 |
| 1996 | 0 | 0 |
| 1997 | 1 | 0 |
| 1998 | 0 | 0 |
| 1999 | 2 | 0 |
| 2000 | 1 | 0 |
| 2001 | 0 | 0 |
| 2002 | 2 | 1 |
| 2003 | 0 | 0 |
| 2004 | 1 | 0 |
| 2005 | 0 | 1 |
| 2006 | 0 | 8 |
| 2007 | 2 | 14 |
| 2008 | 6 | 6 |
| 2009 | 5 | 6 |
| 2010 | 6 | 1 |
| 2011 | 2 | 4 |
| 2012 | 1 | 2 |
| 2013 | 3 | 6 |
| 2014 | 1 | 7 |
| 2015 | 7 | 5 |
| 2016 | 3 | 6 |
| 2017 | 6 | 4 |
| 2018 | 6 | 8 |
| 2019 | 12 | 18 |
| 2020 | 15 | 8 |
| 2021 | 11 | 15 |
| 2022 | 11 | 19 |
| 2023 | 8 | 15 |
| 2024 | 9 | 11 |
| 2025 | 13 | 4 |
| 2026 | 7 | 4 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Differential transmission board set and assembly9 Jun 2026US 12,652,773 B2Japan Aviation Electronics Industry, Limited
- Bond pad connector for securing an electronic component thereon19 May 2026US 12,635,074 B2Jabil Inc.
- Differential transmission board set and assembly19 May 2026US 12,635,099 B2Japan Aviation Electronics Industry, Limited
- Display module and electronic device including the same12 May 2026US 12,628,278 B2Samsung Electronics Co., Ltd.
- Differential transmission board set and assembly12 May 2026US 12,628,300 B2Japan Aviation Electronics Industry, Limited
- Connector, connector unit, and method for connecting to connection substrate in connector11 Jun 2026US 2026/0163271 A1Japan Aviation Electronics Industry, Limited
- Substrate and connector unit11 Jun 2026US 2026/0164542 A1Japan Aviation Electronics Industry, Limited
- Devices Including Substrate Structure With Laterally Offset Ground Vias And Metal Balls12 Mar 2026US 2026/0075712 A1Mediatek Inc.
- Storage device and printed circuit board for solid state drive26 Feb 2026US 2026/0059663 A1SK hynix Inc.
- Method for electrically connecting electronic components of a battery system and battery system21 Aug 2025US 2025/0266629 A1Samsung SDI.Co., Ltd.
Most cited
By later US patents
- Semiconductor module with imbedded heat spreader126US 6,449,159 B1Rambus Inc. · 2002
- Assembly for circuit modules122US 4,811,165 AMotorola, Inc. · 1989
- Semiconductor module with serial bus connection to multiple dies118US 6,833,984 B1Rambus Inc. · 2004
- Printed circuit board telephone interface70US 4,767,338 A1988
- Electronic circuit apparatus53US 4,858,071 AMatsushita Electric Industrial Co., Ltd. · 1989