Devices Including Substrate Structure With Laterally Offset Ground Vias And Metal Balls
AssigneeMediatek Inc.
InventorsChing-Ku Liao, Cheng-Wei Tsai
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Abstract
Devices including a substrate structure with laterally offset ground vias and metal balls are provided. A device may include a substrate, a plurality of first ground vias, and a plurality of first metal balls. The plurality of first ground vias may be formed within the substrate and surrounding a plurality of signal vias. The plurality of first metal balls may be disposed on the substrate and electrically coupled to the plurality of first ground vias. One first metal ball may be electrically coupled to one first ground via. A part of the plurality of first ground vias may be laterally offset from a corresponding part of the plurality of first metal balls along a direction orthogonal to the substrate.
Claims20
A device, comprising:
- a substrate;
- a plurality of first ground vias, formed within the substrate and surrounding a plurality of signal vias;
- and
- a plurality of first metal balls, disposed on the substrate and electrically coupled to the plurality of first ground vias, wherein one first metal ball is electrically coupled to one first ground via,
- wherein a part of the plurality of first ground vias is laterally offset from a corresponding part of the plurality of first metal balls along a direction orthogonal to the substrate.
A device, comprising:
- a substrate;
- a plurality of first ground vias, formed within the substrate and surrounding a plurality of signal vias;
- and
- a plurality of first metal balls, disposed on the substrate and electrically coupled to the plurality of first ground vias, wherein one first metal ball is electrically coupled to one first ground via,
- wherein a first pitch associated with the plurality of first ground vias is less than a second pitch associated with the plurality of first metal balls.
Dependencies are inferred from the claim text.