Semiconductor module with imbedded heat spreader
AssigneeRambus Inc.
InventorBelgacem Haba
Life of this patent
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Abstract
The invention provides a semiconductor module comprising a heat spreader, at least two semiconductors thermally coupled to the heat spreader, and a plurality of electrically conductive leads electrically connected to the semiconductors. The leads may form part of a flexible circuit at least partially attached to the heat spreader, where at least one of the electrically conductive leads is preferably common to both of the semiconductors. The two semiconductors may be mounted or preferably directly bonded onto opposing side walls of the heat spreader. The invention also provides a method of making the abovementioned semiconductor module.
Claims35
A semiconductor module, comprising:
- a heat spreader comprising separate first and second regions for connecting to channels of a substrate;
- at least two semiconductors thermally coupled to said heat spreader;
- a plurality of electrically conductive leads electrically connected to said semiconductors, where at least one of said electrically conductive leads is common to both of said semiconductors;
- a first set of electrical contact points disposed on said first region and electrically connected to said plurality of electrically conductive leads, where said first set of electrical contact points is for ingress of electrical signals from said channels to at least one of said at least two semiconductors;
- and
- a second set of electrical contact points disposed on said second region and electrically connected to said plurality of electrically conductive leads, where said second set of electrical contact points is for egress of electrical signals to said channels from at least one of said at least two semiconductors, and where said first and second sets of electrical contact points are separate and distinct from one another, and where at least some of said first set of electrical contact points, said plurality of electrically conductive leads, and said second set of electrical contact points form a continuous signal channel for ingress and egress of said electrical signals from and to said channels.
A method of making a semiconductor module, comprising:
- providing a plurality of electrically conductive leads;
- electrically connecting at least two semiconductors to said plurality of electrically conductive leads, where at least one of said electrically conductive leads is common to both of said semiconductors;
- thermally coupling said semiconductors to a heat spreader comprising separate first and second regions for connecting to channels of a substrate;
- electrically connecting said plurality of electrically conductive leads to a first set of electrical contact points disposed on said first region, where said first set of electrical contact points is for ingress of electrical signals from said channels to at least one of said at least two semiconductors;
- electrically connecting said plurality of electrically conductive leads to a second set of electrical contact points disposed on said second region, where said second set of electrical contact points is for egress of electrical signals to said channels from at least one of said at least two semiconductors, and where said first and second sets of electrical contact points are separate and distinct from one another, and where at least some of said first set of electrical contact points, said plurality of electrically conductive leads, and said second set of electrical contact points form a continuous signal channel for ingress and egress of said electrical signals from and to said channels.
Dependencies are inferred from the claim text.