H05K 2201/09418
Special orientation of pads, lands or terminals of component
Official title: Special orientation of pads, lands or terminals of component, e.g. radial or polygonal orientation
H05K2201/09418 (Special orientation of pads, lands or terminals of component) appears on 253 US grants and 265 published applications in this corpus.
Search patents in H05K- Granted patents
- 253
- Published applications
- 265
- Assignees
- 198
- Inventors
- 630
- Latest grant
- 14 Jul 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 2 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 2 | 0 |
| 1989 | 4 | 0 |
| 1990 | 4 | 0 |
| 1991 | 4 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 1 | 0 |
| 1996 | 4 | 0 |
| 1997 | 2 | 0 |
| 1998 | 3 | 0 |
| 1999 | 2 | 0 |
| 2000 | 4 | 0 |
| 2001 | 4 | 3 |
| 2002 | 2 | 5 |
| 2003 | 7 | 10 |
| 2004 | 3 | 8 |
| 2005 | 9 | 10 |
| 2006 | 9 | 13 |
| 2007 | 9 | 11 |
| 2008 | 9 | 9 |
| 2009 | 2 | 14 |
| 2010 | 8 | 11 |
| 2011 | 8 | 4 |
| 2012 | 5 | 5 |
| 2013 | 6 | 7 |
| 2014 | 4 | 9 |
| 2015 | 5 | 14 |
| 2016 | 9 | 10 |
| 2017 | 19 | 12 |
| 2018 | 16 | 10 |
| 2019 | 16 | 13 |
| 2020 | 8 | 13 |
| 2021 | 12 | 18 |
| 2022 | 14 | 13 |
| 2023 | 9 | 13 |
| 2024 | 13 | 8 |
| 2025 | 9 | 10 |
| 2026 | 5 | 12 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Transparent package for use with printed circuit boards14 Jul 2026US 12,684,689 B2Honeywell Federal Manufacturing & Technologies, LLC
- Microelectronic device package assemblies including stiffener devices, and related microelectronic devices and electronic systems12 May 2026US 12,628,267 B2Micron Technology, Inc.
- Soldering board arrangement3 Mar 2026US 12,568,580 B2PHYTEC Messtechnik GmbH
- Electronic component, electric device including the same, and bonding method thereof27 Jan 2026US 12,538,424 B2Samsung Display Co., Ltd.
- Electrical module and printed circuit board assembly comprising an electrical module27 Jan 2026US 12,538,425 B2Rolls-Royce Deutschland Ltd & Co KG
- Apparatuses including stiffener devices17 Sep 2026US 2026/0282214 A1Micron Technology, Inc.
- Substrate and cable assembly17 Sep 2026US 2026/0282228 A1Nissei Electric Co., Ltd.
- Printed circuit board hardware interface with reduced crosstalk20 Aug 2026US 2026/0247522 A1Microsoft Technology Licensing, LLC
- Circuit element, electronic packaging element and circuit board assembly16 Jul 2026US 2026/0206128 A1National Tsing Hua University
- Circuit board and circuit board assembly2 Jul 2026US 2026/0190226 A1Zte Corporation
Most cited
By later US patents
- Three-dimensional circuit component assembly and method corresponding thereto179US 4,833,568 A1989
- Electrical connector system with orthogonal contact tails110US 8,251,745 B2FCI Americas Technology, Inc. · 2012
- Arrangement of pads and through-holes for semiconductor packages95US 5,784,262 ASymbios, Inc. · 1998
- Surface mounted array strain relief device62US 4,764,848 AInternational Business Machines Corporation · 1988
- Self aligning electrical component62US 5,898,574 A1999